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WOO YOUNG KOAN

Overview
  • Total Patents
    32
  • GoodIP Patent Rank
    154,879
About

WOO YOUNG KOAN has a total of 32 patent applications. Its first patent ever was published in 2010. It filed its patents most often in Republic of Korea, WIPO (World Intellectual Property Organization) and Taiwan. Its main competitors in its focus markets audio-visual technology, packaging and shipping and machines are AT&S (CHINA) CO LTD, IBIDEN DENSHI KOGYO KK and SIMMTECH CO LTD.

Patent filings in countries

World map showing WOO YOUNG KOANs patent filings in countries

Patent filings per year

Chart showing WOO YOUNG KOANs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Woo Young Koan 32
#2 Kim Ju Hee 2
#3 Lee Jae Hak 2
#4 Lee Chun Sik 1
#5 Kim Bo Hwan 1
#6 Choi Pil Gyu 1
#7 Lee Jae-Hak 1
#8 Song Su Gyeong 1

Latest patents

Publication Filing date Title
WO2020262783A1 Method for attaching member plate for attachment to printed circuit board by using automatic correction function
KR20190094794A Method of processing thermo-sensitive adhesive film using pinnacle mold
KR102004748B1 Micro led transfer method
KR20180038645A Coverlay attaching apparatus
KR20180038646A Additional plate supplying apparatus for attaching onto fpcb
KR20180038644A Apparatus for attaching additional plate to fpc
KR101747806B1 Supplying apparatus of additional plate for printed circuit board
KR101695704B1 Film sheet separating device and film sheet attaching device comprising the same
KR20160149752A Method and apparatus for stacking sheet type product
KR101643141B1 Coverlay supplying device and coverlay attaching apparatus comprising the same
KR20150067447A Method and apparatus for removing transfer film from surface of flexible printed circuit board
KR20140137547A Method of adhering additional plate onto printed circuit board
KR20140137075A Apparatus for mounting additional plate to fpc
KR20140054876A Push-back mold with knuck-out function
KR101359130B1 Multi-bonding machine
TW201318486A Appartus for adhering additional plate to fpc and additional plate separating unit and press unit used in the apparatus
KR20140021864A Method of providing additional plate for adhering onto printed circuit board
KR20130119057A Multi-bonding machine and multi-bonding unit used for the same
KR20130030372A Apparatus and method for adhering additional plate to fpc
KR20130030374A Apparatus for adhering additional plate to fpc and press unit used in the apparatus