WILLIAMS DAVID GODFREY has a total of 25 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 1975. It filed its patents most often in United Kingdom, WIPO (World Intellectual Property Organization) and Australia. Its main competitors in its focus markets audio-visual technology, textiles and paper and engines, pumps and turbines are FRIEDRICH DIETER, PARAT CO LTD and EKRA AUTOMATISIERUNGSSYSTEME G.
# | Country | Total Patents | |
---|---|---|---|
#1 | United Kingdom | 11 | |
#2 | WIPO (World Intellectual Property Organization) | 5 | |
#3 | Australia | 4 | |
#4 | EPO (European Patent Office) | 1 | |
#5 | Hong Kong | 1 | |
#6 | India | 1 | |
#7 | Singapore | 1 | |
#8 | United States | 1 |
# | Industry | |
---|---|---|
#1 | Audio-visual technology | |
#2 | Textiles and paper | |
#3 | Engines, pumps and turbines | |
#4 | Chemical engineering | |
#5 | Surface technology and coating | |
#6 | Machine tools |
# | Name | Total Patents |
---|---|---|
#1 | Williams David Godfrey | 21 |
#2 | David Godfrey Williams | 2 |
#3 | Hutterer Johann | 1 |
#4 | Michael Routledge | 1 |
Publication | Filing date | Title |
---|---|---|
GB201908756D0 | Sparkler nozzle | |
GB201706673D0 | Splitting device | |
GB0204926D0 | Screen printing stencil with at least one apertured region to increase the extensibility of the stencil | |
GB0003700D0 | Soldering method and method of mixing solder paste | |
GB9904818D0 | Method and apparatus for conditioning solder paste | |
GB9619621D0 | Improved stencil tensioning frame and stencil mounting/dismounting apparatus therefor | |
GB9514927D0 | Improved apparatus for supporting and tensioning a stencil or mask for use in applying solder paste to circuit boards and a mounting support means therefor | |
GB9306971D0 | Improved stencil or mask for applying solder to circuit boards | |
GB9304663D0 | Improved stencil or mask for applying solder to circuit boards and support frame | |
GB8531550D0 | A valve component for a frictionless guided valve |