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PARAT CO LTD

Overview
  • Total Patents
    24
  • GoodIP Patent Rank
    76,492
  • Filing trend
    ⇧ 100.0%
About

PARAT CO LTD has a total of 24 patent applications. It increased the IP activity by 100.0%. Its first patent ever was published in 2011. It filed its patents most often in Japan, EPO (European Patent Office) and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets audio-visual technology and machine tools are FRIEDRICH DIETER, HOLLIS AUTOMATION INC and HY BEC CORP.

Patent filings in countries

World map showing PARAT CO LTDs patent filings in countries

Patent filings per year

Chart showing PARAT CO LTDs patent filings per year from 1900 to 2020

Focus industries

Top inventors

# Name Total Patents
#1 Ataru Shinichiro 19
#2 Naka Iwao 7
#3 Naka Shinichiro 2
#4 Hatano Shoichi 2
#5 Hagio Koichi 1
#6 Ishigaki Seiya 1
#7 Maruyama Keisuke 1
#8 Yamashita Yasushi 1
#9 Yada Akihiro 1
#10 Murata Katsunori 1

Latest patents

Publication Filing date Title
JP2020167246A Soldering device and nozzle therefor
JP2020089902A Soldering device and soldering method
JP2020061508A Soldering device and nozzle for soldering device
JP2020006405A Soldering device and soldering method
JP2019179785A Soldering apparatus and soldering method
JP2019162639A Soldering device and nozzle for soldering device
JP2019155461A Soldering apparatus and nozzle for soldering apparatus
JP2019155381A Soldering apparatus and soldering method
JP2019155380A Soldering apparatus and nozzle for soldering apparatus
WO2018025787A1 Soldering device and soldering method
JP2018186180A Soldering device and soldering method
JP2018186147A Soldered product manufacturing method, soldered product, soldering method, and soldering apparatus
JP2018077049A Soldering iron temperature measurement system and soldering iron temperature measurement method
JP2018061978A Soldering system, solder product manufacturing method, soldering method, and solder
JP2018019049A Soldering device, soldering method, manufacturing method of printed circuit board, and manufacturing method of product
JP2017028290A Soldering device and soldering method
JP2017201266A Temperature measurement device and temperature measurement method
JP2017189972A Gate cutting device and gate cutting method
JP2017087261A Soldering device, soldering method, and soldering magazine
JP2017092222A Soldering device and soldering method