WILLIAMS ADVANCED MATERIALS IN has a total of 25 patent applications. Its first patent ever was published in 1990. It filed its patents most often in WIPO (World Intellectual Property Organization), United States and EPO (European Patent Office). Its main competitors in its focus markets materials and metallurgy, audio-visual technology and surface technology and coating are HEADWAY TECH INC, RICOH GEN ELECTRON RES INST and SAMSUNG JAPAN CORP.
# | Country | Total Patents | |
---|---|---|---|
#1 | WIPO (World Intellectual Property Organization) | 9 | |
#2 | United States | 6 | |
#3 | EPO (European Patent Office) | 4 | |
#4 | Canada | 2 | |
#5 | Australia | 1 | |
#6 | Brazil | 1 | |
#7 | China | 1 | |
#8 | Taiwan | 1 |
# | Industry | |
---|---|---|
#1 | Materials and metallurgy | |
#2 | Audio-visual technology | |
#3 | Surface technology and coating | |
#4 | Electrical machinery and energy | |
#5 | Semiconductors | |
#6 | Environmental technology | |
#7 | Machines | |
#8 | Machine tools |
# | Name | Total Patents |
---|---|---|
#1 | Lichtenberger Heiner | 16 |
#2 | Brown Derrick L | 6 |
#3 | Grohman Henry L | 5 |
#4 | Haluska Scott | 5 |
#5 | Acker Robert | 5 |
#6 | Willson Matthew T | 3 |
#7 | Wilson Matthew T | 2 |
#8 | Ganguly Adrish | 1 |
#9 | Wilsson Matthew T | 1 |
#10 | Snyder James W | 1 |
Publication | Filing date | Title |
---|---|---|
WO2008045779A2 | Gold die bond sheet preform | |
WO2007062165A2 | Alloys for flip chip interconnects and bumps | |
US2006032740A1 | Slotted thin-film sputter deposition targets for ferromagnetic materials | |
CA2575877A1 | Copper based alloys and optical media containing same | |
US2005048251A1 | Silver alloys for optical data storage and optical media containing same | |
WO2004003903A1 | Corrosion resistive silver metal alloys for optical data storage and recordable storage media containing same | |
TW200401285A | Silver-reactive metal alloys for optical data storage and recordable storage media containing same | |
AU2015402A | Ion beam deposition targets having an interlocking interface and a replaceable insert | |
US6390353B1 | Integral solder and plated sealing cover and method of making the same | |
WO9109699A1 | Welding of solder frame to ceramic lid in semi-conductor packaging |