| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Japan | 5 | |
| #2 | China | 3 | |
| #3 | WIPO (World Intellectual Property Organization) | 3 | |
| #4 | Australia | 1 | |
| #5 | Republic of Korea | 1 | |
| #6 | Taiwan | 1 | |
| #7 | United States | 1 |
| # | Industry | |
|---|---|---|
| #1 | Machine tools | |
| #2 | Semiconductors |
| # | Technology | |
|---|---|---|
| #1 | Soldering, welding and flame cutting | |
| #2 | Semiconductor devices |
| # | Name | Total Patents |
|---|---|---|
| #1 | Ishii Tatsuya | 7 |
| #2 | Harada Shinichi | 5 |
| #3 | Adachi Shinichi | 2 |
| #4 | Harada Sinichi | 2 |
| #5 | Hiramatsu Shigeru | 2 |
| #6 | Tatsuya Ishii | 1 |
| Publication | Filing date | Title |
|---|---|---|
| JP2018012200A | Heater chip, joint device and joint method | |
| WO2017038282A1 | Heater chip, bonding device, and bonding method | |
| JP2017062945A | Heater chip, joining device and joining method | |
| JP2005340599A | Heater chip for wiring connection | |
| JP2005066636A | Heater tip for thermocompression bonding | |
| JP2005319468A | Heater chip for thermocompession bonding |