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UNIPLUS ELECTRONICS CO LTD

Overview
  • Total Patents
    46
  • GoodIP Patent Rank
    188,126
  • Filing trend
    ⇩ 100.0%
About

UNIPLUS ELECTRONICS CO LTD has a total of 46 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2002. It filed its patents most often in Taiwan, China and Republic of Korea. Its main competitors in its focus markets audio-visual technology, machine tools and macromolecular chemistry and polymers are ISOLA LAMINATE SYSTEMS CORP, JOHNSON & JOHNSTON ASS INC and TONOGA INC.

Patent filings in countries

World map showing UNIPLUS ELECTRONICS CO LTDs patent filings in countries
# Country Total Patents
#1 Taiwan 15
#2 China 11
#3 Republic of Korea 8
#4 Japan 7
#5 United States 5

Patent filings per year

Chart showing UNIPLUS ELECTRONICS CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Chang Chung Hao 8
#2 Chang Chung-Hao 8
#3 Hsiao Ming-Cheng 7
#4 Huag Han Shiang 6
#5 Chien Tai-Wen 5
#6 Liu Li-Hung 4
#7 Yeh Chia Hsiu 4
#8 Yen Cheng-Nan 4
#9 Yeh Yun Chao 3
#10 Lin Hui Min 3

Latest patents

Publication Filing date Title
CN111688304A Melamine plate for PCB drilling and manufacturing method thereof
CN108541137A Conductive cover plate
CN105583889A Cover plate for hole drilling
TW201613757A A drilling entry board
TW201402796A High heat resistant, low elastic modulus and fire resistant resin and its compounds
CN103525086A High-heat-resistance low-rigidity flame-retardant resin and compositions thereof
CN103008729A Drilling auxiliary board for printed circuit board
TW201315311A Drilling backing plate for printed circuit board
JP2012111807A Thermosetting resin composition and prepreg sheet or laminated board using the thermosetting resin composition
JP2012097237A Non-halogen, non-phosphorus thermosetting resin composition
KR20120039962A Halogen-free and phosphorus-free thermosetting resin composition
CN102453225A Thermosetting resin composition and its application in prepreg film or laminated plate
TW201215627A Thermosetting resin composition
CN102372903A Halogen-free phosphorus-free thermosetting resin composition
TW201206980A Halogen - free phosphorus - free thermosetting resin composition
KR20110042764A High thermal conductivity and low dissipation factor adhesive varnish for build-up additional insulation layers
KR20110039083A Method for preparing a high thermal conductivity and low dissipation factor adhesive varnish for build-up additional insulation layers
JP2011079986A Method for producing laminating adhesive having high thermal conductivity and low dissipation factor
JP2011079968A High thermal conductivity and low loss factor build-up material
TW201109403A High thermal conductivity and low dissipation factor adhesive varnish for build-up additional insulation layers