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TOTO KASEI CO LTD

Overview
  • Total Patents
    110
About

TOTO KASEI CO LTD has a total of 110 patent applications. Its first patent ever was published in 1994. It filed its patents most often in Japan and Taiwan. Its main competitors in its focus markets macromolecular chemistry and polymers, audio-visual technology and semiconductors are TOTO KASEI KK, CHOSHUN JINZO JUSHISHO KOFUN Y and YUKA SHELL EPOXY KK.

Patent filings in countries

World map showing TOTO KASEI CO LTDs patent filings in countries
# Country Total Patents
#1 Japan 109
#2 Taiwan 1

Patent filings per year

Chart showing TOTO KASEI CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Asano Chiaki 25
#2 Takeda Yasuyuki 25
#3 Gunji Masao 20
#4 Asakage Hideyasu 16
#5 Ishihara Kazuo 16
#6 Nozawa Hidenori 15
#7 Saito Yoshihisa 14
#8 Hanabusa Masayoshi 14
#9 Yoshida Kazuhiko 13
#10 Takuwa Naritsuyo 11

Latest patents

Publication Filing date Title
JP2010033029A Resin composition for optical waveguide, and optical waveguide produced by employing the resin composition
JP2010120989A Epoxy resin composition
JP2010070470A Phenol compound comprising phosphorus, method of producing the same, curable resin composition employing the same, and cured article
JP2010059281A Epoxy resin composition for fiber-reinforced composite material permitting demolding after primary curing
JP2010018765A Phosphorus-containing epoxy resin using phosphorus-containing phenol compound obtained by specific method of manufacturing, phosphorus-containing epoxy resin composition using the resin, and cured product
JP2009280734A New epoxy resin and method for producing the same, epoxy resin composition comprising the epoxy resin, and cured product essentially comprising the epoxy resin
JP2009185087A Phosphorus-containing epoxy resin, phosphorus-containing epoxy resin composition, method for producing phosphorus-containing epoxy resin, curable resin composition using phosphorus-containing epoxy resin, and cured product
JP2009080094A Method and device for predicting migration resistance of printed board
JP2009161629A Novel phosphorus-containing flame retardant resin, epoxy resin composition containing the same and cured product thereof
JP2009073933A Epoxy resin composition having thermal degradation resistance
JP2009029842A Epoxy resin composition
JP2008239853A Epoxy resin, epoxy resin composition and cured product thereof
JP2008239891A Novel epoxy resin, epoxy resin composition containing the same, and cured matter therefrom
JP2008239696A Novel thermoplastic polyhydroxypolyether resin and resin composition comprising the same
JP2008231071A New polyvalent hydroxy compound, and epoxy resin composition and its cured product
JP2008222837A New polyhydric hydroxy compound, method for producing the hydroxy compound, and thermosetting resin composition containing the hydroxy compound and its cured product
JP2008222838A Epoxy resin and epoxy resin composition and its cured product
JP2008214513A New phosphorus-containing epoxy resin, epoxy resin composition having the epoxy resin as indispensable component, and its cured product
JP2008208318A Non-solvent type polyurethane-based paint or resin composition for adhesive
JP2008208315A Non-halogen flame retardant adhesive and material for flexible printed wiring board using the same