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TOSHIBA CHEM CORP

Overview
  • Total Patents
    2,036
About

TOSHIBA CHEM CORP has a total of 2,036 patent applications. Its first patent ever was published in 1983. It filed its patents most often in Japan, United States and EPO (European Patent Office). Its main competitors in its focus markets audio-visual technology, semiconductors and machines are SUBTRON TECHNOLOGY CO LTD, COMPEQ MFG CO LTD and SUMITOMO KINZOKU ELECTRO.

Patent filings in countries

World map showing TOSHIBA CHEM CORPs patent filings in countries

Patent filings per year

Chart showing TOSHIBA CHEM CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Okunoyama Teru 177
#2 Sawai Kazuhiro 119
#3 Kurokawa Tokuo 91
#4 Iwase Hidehiro 74
#5 Kokubo Masanori 55
#6 Suzuki Tetsuaki 54
#7 Furuhashi Jun 53
#8 Akimoto Hiroshi 46
#9 Nagata Tsutomu 46
#10 Ueki Masaaki 45

Latest patents

Publication Filing date Title
WO0206399A1 Halogen-free flame-retardant epoxy resin compoisition, halogen-free flame-retardant epoxy resin composition for build-up type multilayer boards, prepregs, copper-clad laminates, printed wiring boards, resin films with copper foil or carriers, and build-up type laminates and multilayer boards
JP2002318163A Pressure sensor and its manufacturing method
JP2002319750A Printed-wiring board, semiconductor device, and their manufacturing methods
JP2002317028A One-pack epoxy resin composition and electrical part device
JP2002313996A Substrate for semiconductor package, and its manufacturing method
JP2002316318A Prepreg manufacturing method and foreign matter removing device
JP2002308986A Photopolymer composition and method for producing the same
JP2002308967A Method for suppressing cure reaction of epoxy resin composition
JP2002309065A Die bonding paste
JP2002307433A Prepreg manufacturing method and manufacturing apparatus using the same
JP2002303977A Photosensitive resin composition and positive type pattern forming method
JP2002304913A Conductive paste
JP2002305212A Mounting paste for semiconductor
JP2002302531A Epoxy resin composition and molded product
JP2002294199A Thermocompression adhesive for electronic device
JP2002294032A Resin composition for liquid sealing
JP2002299826A Multilayered printed wiring board, semiconductor device, and their manufacturing methods
JP2002284909A Method for producing prepreg and production apparatus using the method
JP2002284908A Method for producing prepreg
JP2002280604A Optical semiconductor device