| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 19 | |
| #2 | Japan | 2 |
| # | Industry | |
|---|---|---|
| #1 | Audio-visual technology | |
| #2 | Machines | |
| #3 | Semiconductors | |
| #4 | Environmental technology | |
| #5 | Computer technology | |
| #6 | Telecommunications | |
| #7 | Digital networks | |
| #8 | Optics | |
| #9 | Machine tools |
| # | Name | Total Patents |
|---|---|---|
| #1 | Tanaka Hironori | 21 |
| #2 | Fujii Naoaki | 2 |
| #3 | Yoshikawa Kazuhiro | 2 |
| #4 | Yamashita Atsunari | 2 |
| #5 | Shimizu Keisuke | 2 |
| #6 | Kawano Shuichi | 1 |
| Publication | Filing date | Title |
|---|---|---|
| US2009231820A1 | Capacitor-incorporated printed wiring board and electronic component | |
| US2009139760A1 | Multilayer printed wiring board with a built-in capacitor | |
| US2009038830A1 | Substrate with low-elasticity layer and low-thermal-expansion layer | |
| JPS6172672A | Method of burning ceramic product | |
| JPS6149991A | Method of baking ceramic product |