| # | Country | Total Patents | |
|---|---|---|---|
| #1 | EPO (European Patent Office) | 5 | |
| #2 | United States | 4 | |
| #3 | WIPO (World Intellectual Property Organization) | 4 | |
| #4 | Japan | 2 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Medical technology | |
| #3 | Electrical machinery and energy | |
| #4 | Machines |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Electrotherapy | |
| #3 | Diagnosis and surgery | |
| #4 | Electrically-conductive connections | |
| #5 | Unspecified technologies |
| # | Name | Total Patents |
|---|---|---|
| #1 | Motoyoshi Makoto | 15 |
| #2 | Koyanagi Mitsumasa | 5 |
| #3 | Mushiake Hajime | 5 |
| #4 | Katayama Norihiro | 5 |
| #5 | Iwasaki Masaki | 3 |
| #6 | Tanaka Tetsu | 2 |
| Publication | Filing date | Title |
|---|---|---|
| EP3796367A1 | Stacked semiconductor device and multiple chips used therein | |
| JP2018190774A | External connection mechanism, semiconductor device and lamination package | |
| JP2018190775A | Solid-state imaging apparatus | |
| EP2966680A1 | Laminate and method of producing same | |
| WO2014097450A1 | Brain electrode system | |
| WO2012114501A1 | Brain probe and method for manufacturing same |