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TIANJIN ZHONGHUAN ADVANCED & MATERIAL TECH CO LTD

Overview
  • Total Patents
    23
  • GoodIP Patent Rank
    72,695
About

TIANJIN ZHONGHUAN ADVANCED & MATERIAL TECH CO LTD has a total of 23 patent applications. Its first patent ever was published in 2019. It filed its patents most often in China. Its main competitors in its focus markets semiconductors, machine tools and measurement are Tianjin zhonghuan advanced material technology co ltd, JIANGSU YINGRUI SEMICONDUCTOR CO LTD and KNJ CO LTD.

Patent filings in countries

World map showing TIANJIN ZHONGHUAN ADVANCED & MATERIAL TECH CO LTDs patent filings in countries
# Country Total Patents
#1 China 23

Patent filings per year

Chart showing TIANJIN ZHONGHUAN ADVANCED & MATERIAL TECH CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Sun Chenguang 22
#2 Wu Wei 20
#3 You Bailing 20
#4 Liu Yuan 19
#5 Yang Chunxue 19
#6 Liu Jianwei 19
#7 Lyu Ying 19
#8 Liu Miao 19
#9 Pei Kunyu 19
#10 Zhu Bin 19

Latest patents

Publication Filing date Title
CN111823120A Semiconductor wafer polishing equipment and polishing method
CN111781243A Silicon wafer micro-defect testing method
CN111781204A Method for testing annular faults of semiconductor round silicon wafer
CN111546239A Silicon wafer side polishing liquid supplementing system, liquid supplementing method and silicon wafer side polishing method
CN111659670A Double-polishing machine carrier cleaning equipment and cleaning process thereof
CN111446188A Semiconductor silicon wafer surface cleaning mechanism and cleaning process thereof
CN111546519A Cutting process for improving geometric parameters of large-diameter silicon wafer
CN111180369A Semiconductor polished wafer cleaning equipment and cleaning method
CN111267256A Cutting process for improving surface nanotopography of large-diameter silicon wafer
CN111186701A Automatic look for reference code reading equipment
CN111243990A System and method for positioning and detecting number of round crystal
CN111112846A Silicon wafer laser marking method
CN111211042A Cleaning process for improving surface cleanliness of side-polished large-diameter silicon wafer
CN111203792A Method for controlling thickness of heavily doped product after polishing
CN111199874A Silicon wafer cleaning process
CN110970333A Photoresist removing equipment for large-diameter silicon wafer and using method
CN110842783A Silicon wafer polishing pad cleaning device and cleaning method
CN110842762A Large-size silicon wafer thinning device and thinning process thereof
CN110931348A Large-size silicon wafer alkaline corrosion cleaning device and cleaning process
CN110718457A Machining process for reducing zone-melting POLY back-sealed single polished wafer edge crystal hole