TEXAS INSTRUMETNS INC has a total of 97 patent applications. Its first patent ever was published in 2006. It filed its patents most often in China and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets telecommunications, semiconductors and computer technology are TEXAS INSTRUMENTS INC, SEMTECH CORP and 58TH RES INSTITUTE CETC.
# | Country | Total Patents | |
---|---|---|---|
#1 | China | 96 | |
#2 | WIPO (World Intellectual Property Organization) | 1 |
# | Industry | |
---|---|---|
#1 | Telecommunications | |
#2 | Semiconductors | |
#3 | Computer technology | |
#4 | Digital networks | |
#5 | Basic communication technologies | |
#6 | Environmental technology | |
#7 | Measurement |
# | Name | Total Patents |
---|---|---|
#1 | Chen Runhua | 8 |
#2 | Pendharkar Sameer | 5 |
#3 | Bendlin Ralf M | 5 |
#4 | Tipirneni Naveen | 4 |
#5 | Khanna Sudhanshu | 4 |
#6 | Onggosanusi Eko N | 4 |
#7 | Bartling Steven Craig | 4 |
#8 | Wygant Ira Oaktree | 3 |
#9 | Barsukov Yevgen | 3 |
#10 | Ho Jin-Meng | 3 |
Publication | Filing date | Title |
---|---|---|
CN104541375A | Mos transistors having reduced leakage well-substrate junctions | |
CN104521156A | Uplink signaling for cooperative multipoint communication | |
CN104411619A | Sensor MEMS device cantilever packaging | |
CN104412365A | Sinker with reduced width | |
CN104335475A | Driver for capacitive loads | |
CN104272457A | Wafer scale packaging die with offset redistribution layer capture pad | |
CN104321655A | Integrated circuits capable of generating test mode control signals for scan tests | |
CN104170405A | Low nose and low power arrangement for playing audio signals | |
CN104247307A | Ultrasonic receiver front-end | |
CN104160721A | High frequency cmut | |
CN103080768A | Terahertz phased array system |