Learn more

TELEDYNE LICENSING LLC

Overview
  • Total Patents
    69
About

TELEDYNE LICENSING LLC has a total of 69 patent applications. Its first patent ever was published in 1999. It filed its patents most often in United States and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets semiconductors, optics and audio-visual technology are ALTUS TECHNOLOGY INC, HSU CHIA-LIANG and ST MICROELECTRONICS CROLLES 2 SAS.

Patent filings in countries

World map showing TELEDYNE LICENSING LLCs patent filings in countries

Patent filings per year

Chart showing TELEDYNE LICENSING LLCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Denatale Jeffrey F 12
#2 Lauxtermann Stefan C 8
#3 Stupar Philip A 8
#4 Borwick Iii Robert L 7
#5 Winker Bruce K 5
#6 Nagy Gabor 4
#7 Kendig Martin W 4
#8 Gu Dong-Feng 4
#9 Brar Berinder 4
#10 Ikhlassi Amal 4

Latest patents

Publication Filing date Title
US7538307B1 Charge multiplication CMOS image sensor and method for charge multiplication
US2009160989A1 Low noise readout apparatus and method with snapshot shutter and correlated double sampling
US2008130081A1 Manufacturing method for stress compensated X-Y gimbaled MEMS mirror array
US2009128385A1 Resettable high order delta-sigma analog to digital converter
US2009121307A1 Simultaneous unipolar multispectral integrated technology (SUMIT) detectors
US2008225489A1 Heat spreader with high heat flux and high thermal conductivity
US2009090846A1 Imaging system with low noise pixel array column buffer
US2009052023A1 Dual field of view sighting system
US2009009642A1 Fast-settling line driver design for high resolution video IR and visible imagers
US2008272499A1 Through-wafer vias
US2008217723A1 Backside illuminated CMOS image sensor with pinned photodiode
US2008217661A1 Two-dimensional time delay integration visible CMOS image sensor
US2008218614A1 Dynamic range enhancement scheme for imagers
US2008180112A1 Numerical full well capacity extension for photo sensors with an integration capacitor in the readout circuit using two and four phase charge subtraction
US2007170574A1 Buried via technology for three dimensional integrated circuits
US2007183677A1 Dynamic range compression of high dynamic range imagery
US2007183680A1 Multi-scale image fusion
US2008070399A1 Process for forming low defect density heterojunctions
US2008067559A1 Heterogeneous integration of low noise amplifiers with power amplifiers or switches
US2008067547A1 Epitaxial nucleation and buffer sequence for via-compatible InAs/AlGaSb HEMTs