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TEAMCHEM COMPANY

Overview
  • Total Patents
    21
About

TEAMCHEM COMPANY has a total of 21 patent applications. Its first patent ever was published in 2002. It filed its patents most often in Taiwan, China and Republic of Korea. Its main competitors in its focus markets audio-visual technology, macromolecular chemistry and polymers and machines are TIANJIN LAIRD TECH LIMITED, SONY CHEMICAL CO LTD and TOSHIBA CHEM CORP.

Patent filings in countries

World map showing TEAMCHEM COMPANYs patent filings in countries

Patent filings per year

Chart showing TEAMCHEM COMPANYs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Yeh Syh-Tau 10
#2 Yeh Syh Tau 4
#3 Chen Yao-Ming 4
#4 Chen Michael 3
#5 Sitao Ye 2
#6 Chen Yau-Ming 1
#7 Ye Sitao 1
#8 Syh-Tau Yeh 1
#9 Ye Si-Tao 1
#10 Ye Sz-Tau 1

Latest patents

Publication Filing date Title
KR20130049087A Structure of thermal conductive flexible printed circuit board
CN102958269A Heat-conducting flexible printing circuit board structure
TW201306675A Heat-conductive flexible printed circuit board structure
CN101857788A Ambient-curable anisotropic conductive adhesive
CN101671473A Anisotropic conductive material
KR20100028901A Anisotropic conductive material
US2009035553A1 Anisotropic conductive material
TW200801109A Solder-resistant flexible thermal-set epoxy resin system
US2008017305A1 Method for fabricating multi-layered printed circuit board without via holes
TW200744442A Flexibile substrates with electromagnetic shielding capability
US2008005896A1 Method for fabricating multi-layered flexible printed circuit board without via holes
TW200803680A Method of fabricating multilayer flexible printed circuit board without plated through-holes
CN101087495A Making method of multi-layer printed circuit board without leading hole
TW200743423A Manufacturing method of via-free multilayer printed circuit board
TW200742665A Substrate of flexible printed circuit board
TW593576B A method of making solventless photosensitive thermal-setting materials