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TAKATORI CORP

Overview
  • Total Patents
    238
  • GoodIP Patent Rank
    32,343
  • Filing trend
    ⇩ 37.0%
About

TAKATORI CORP has a total of 238 patent applications. It decreased the IP activity by 37.0%. Its first patent ever was published in 1987. It filed its patents most often in Japan, United States and United Kingdom. Its main competitors in its focus markets textiles and paper, machines and machine tools are TAKATORI HITECH CO, TOKYO PREC CO LTD and PATCH FRED R.

Patent filings per year

Chart showing TAKATORI CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Tsuchiya Masataka 21
#2 Morita Masahiro 18
#3 Kimura Shinji 18
#4 Tanigawa Shigeki 16
#5 Imai Takanori 16
#6 Ashida Takahiro 13
#7 Takamura Toyonori 13
#8 Morioka Koichi 12
#9 Nishikawa Etsuo 12
#10 Kita Hiroyuki 12

Latest patents

Publication Filing date Title
JP2020122723A Contour recognition device for workpiece, sewing device, and method therefore
JP2020121392A Wire saw and workpiece cutting method for wire saw
JP2020047767A Feeding device of adhesive tape, feeding method, peeling device of sheet material, and peeling method
JP2020032472A Wire saw device
JP2020031165A Adhesive tape re-sticking device and re-sticking method for substrate
JP2020031166A Adhesive tape peeling device and peeling method
JP2019214439A Sheet material conveying apparatus
JP2019118459A Sewing apparatus
JP2019118988A Cutting device and cutting method of sheet material
JP2019098428A Cutting device and cutting method of sheet material
JP2019040941A Device for bonding adhesion tape to substrate and adhesion method
JP2019018263A Cutting apparatus and cutting method
JP2019001580A Workpiece end control device and control method
JP2018158428A Wire saw and cutting processing method
JP2018122386A Cutting device and cutting method of sheet material
EP3391994A1 Wire saw device, and processing method and processing device for workpiece
JP2018058166A Wire saw device
JP2018058147A Wire saw and wire winding method of wire saw
JP2018041877A Device for adhering adhesive sheet to substrate and adhesion method
JP2018008328A Wire saw device