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SILICON TECHNOLOGY

Overview
  • Total Patents
    55
About

SILICON TECHNOLOGY has a total of 55 patent applications. Its first patent ever was published in 1971. It filed its patents most often in United States, EPO (European Patent Office) and Japan. Its main competitors in its focus markets machine tools, machines and semiconductors are SUPER CUT, KAYEX CORP and LUPI QUINTILIO.

Patent filings in countries

World map showing SILICON TECHNOLOGYs patent filings in countries

Patent filings per year

Chart showing SILICON TECHNOLOGYs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Steere Jr Robert E 13
#2 Steere Robert E Jr 12
#3 Leonard Thomas E 7
#4 Lewandowski Thomas 6
#5 Steere Iii Robert E 3
#6 Steere Robert E 3
#7 Steere Robert 3
#8 Robaato Ii Suteia Jiyunia 3
#9 Kachajian George S 2
#10 Schumacher Frederick Arthur 2

Latest patents

Publication Filing date Title
US5679060A Wafer grinding machine
US5319886A Tool mounting arrangement
US5351444A Blade track control system
US5303687A Blade mount for an inner diameter saw blade
US5205028A Wafer alignment fixture for wafers having notches and/or flats
US5148797A Mounting for an internal diameter saw blade
US5189843A Wafer slicing and grinding machine and a method of slicing and grinding wafers
US5185956A Wafer slicing and grinding system
US5058328A Wafer centering assembly
US4974578A Housing for mounting a spindle of an internal diameter saw blade
US5036624A Notch grinder
US5111622A Slicing and grinding system for a wafer slicing machine
US5076021A Flat grind stage assembly for an automatic edge grinder
US5036628A Seal assembly for a wafer grinding machine
US4716881A Blade mount for inner diameter saw blade
US4638601A Automatic edge grinder
EP0094213A1 A balanced rotary saw blade assembly and a method for balancing the same
US4537177A Balanced rotary saw assembly and a method of balancing the same
US4498449A Precision tensioning device for ID saw blade
US4420909A Wafering system