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TAI SOL ELECTRONICS CO LTD

Overview
  • Total Patents
    165
  • GoodIP Patent Rank
    32,921
  • Filing trend
    ⇧ 366.0%
About

TAI SOL ELECTRONICS CO LTD has a total of 165 patent applications. It increased the IP activity by 366.0%. Its first patent ever was published in 2000. It filed its patents most often in United States, Taiwan and Japan. Its main competitors in its focus markets electrical machinery and energy, thermal processes and semiconductors are TAI-SOL ELECTRONICS CO LTD, TAISOL ELECTRONICS CO LTD and MEYER IV GEORGE ANTHONY.

Patent filings in countries

World map showing TAI SOL ELECTRONICS CO LTDs patent filings in countries
# Country Total Patents
#1 United States 107
#2 Taiwan 37
#3 Japan 18
#4 EPO (European Patent Office) 3

Patent filings per year

Chart showing TAI SOL ELECTRONICS CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Lai Yaw-Huey 77
#2 Cui Ming-Quan 15
#3 Tseng Chuan-Chi 13
#4 Lai Yao-Hui 11
#5 Zeng Quan-Qi 11
#6 Ceng Quan Qi 10
#7 Wu Xiao-Long 9
#8 Liao Wen-Ching 8
#9 Liao Wen-Jing 7
#10 Cui Ming Quan 6

Latest patents

Publication Filing date Title
TW202001176A Vapor chamber using capillary structure and bumps to form liquid and vapor channels characterized by providing a flow guiding effect to both the gas phase working fluid and the liquid phase working fluid and allowing vapor chamber to be thinner
TW201947180A Loop vapor chamber conducive to separation of liquid and gas
TW201948015A Joint vapor chamber assembly with vapor chambers connected by extension wick layer
TW201947179A Loop vapor chamber
TW201945682A Loop heat transfer device with gaseous and liquid working fluid channels separated by partition wall
TW201945681A Loop heat pipe partitioned into a vapor channel and a liquid channel
TW201945680A Loop heat pipe having different pipe diameters characterized in allowing a working liquid to be rapidly returned to the evaporating chamber so as to increase the heat dissipation efficiency
TW201945683A Loop heat pipe with condensation section partially filled with capillary material including an evaporation cavity, a condensation section, a steam flow pipe and a liquid flow pipe, and characterized in ensuring a liquid working fluid to actually absorb and a return speed to be fast
TW201944019A Loop heat pipe with fluid elastic pipes characterized by dividing the interior of liquid segment of a return pipe into channels with smaller diameter so as to allow the working liquid to have liquid elastic effect
US2019242655A1 Flat heat pipe with composite wick material
TW201925714A A method of manufacturing exhaust-pipe-free vapor chamber
US2019113290A1 Vapor chamber with inner ridge forming passage
JP2019032146A Joint assembly of vapor chambers
TW201636565A Heat dissipation structure with separated double layers of partially overlapped heat pipes
TW201633886A Vapor chamber heat dissipation module
TW201628484A Heat dissipation system using cooling chip
TW201627624A Heat-dissipating structure with two separated layers of overlapped heat pipes
TW201616946A Heat sink module for mobile apparatus
TW201604513A Heat pipe with one larger end and manufacturing method thereof
TW201604512A Super thin isothermal plate and manufacturing method thereof