| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Singapore | 3 | |
| #2 | WIPO (World Intellectual Property Organization) | 3 | |
| #3 | Taiwan | 2 | |
| #4 | China | 1 | |
| #5 | EPO (European Patent Office) | 1 | |
| #6 | Republic of Korea | 1 |
| # | Industry | |
|---|---|---|
| #1 | Machine tools | |
| #2 | Machines | |
| #3 | Chemical engineering | |
| #4 | Semiconductors |
| # | Technology | |
|---|---|---|
| #1 | Working stone | |
| #2 | Cutting | |
| #3 | Cleaning | |
| #4 | Sawing | |
| #5 | Semiconductor devices |
| # | Name | Total Patents |
|---|---|---|
| #1 | Chua Eng Hwa | 11 |
| Publication | Filing date | Title |
|---|---|---|
| SG10201503418WA | High Speed Integrated Circuit Pick and Place System | |
| SG10201402670UA | An apparatus and method for wafer stacking | |
| SG186510A1 | Cutting machine and method of cutting | |
| WO2010151228A1 | Cutting machine and method of cutting |