Procedure for removing used cutting wire from re=usable reel
CH688679A5
Wire cutting tool, esp for making thin slices of silicium, crystals or ceramics
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Cutting apparatus with control of wear of abrasive particles for improving geometric properties of cut slices
CH688648A5
sawing device with a piece of hard or brittle material.
EP0552663A1
Device for controlling the geometry of thin plates cut by means of a wire saw
WO9012670A1
Wire with active surface for improving the efficiency of wire sawing
WO9112915A1
Industrial device for sawing parts into thin slices
CH679464A5
Wire saw cuts high cost fine material sections with less waste - uses abrasive medium and induced vibrations applied to cutting wiand work piece
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Abrasive wire cutting unit - has interchangeable wire guide cylinders for adjustment of spacing between wires
CH678610A5
Wire sawing device facilitating control of thin slices - uses abrasive liq. spray at controlled low temp. provided by integral refrigerator and liq. conditioning unit
CH677895A5
Wire cutting appts. for silicon - has steel wires passing around cylinders and through abrasive liquid mixture to slice silicon for electronic components
CH678298A5
Slicer for materials used in electronic components
CH665380A5
Cutting machine for brittle materials e.g. during electronic component - has cutting wire(s) driven by roller system to engage workpiece in abrasive liquid bath
