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SUZHOU DATONG ADVANCED MATERIAL CO LTD

Overview
  • Total Patents
    13
  • GoodIP Patent Rank
    184,615
About

SUZHOU DATONG ADVANCED MATERIAL CO LTD has a total of 13 patent applications. Its first patent ever was published in 2011. It filed its patents most often in China. Its main competitors in its focus markets environmental technology and machines are IND E COMERCIO DE ACUMULADORES, KEIYO KOGYO KK and MATSUDA SEISAKUSHO.

Patent filings in countries

World map showing SUZHOU DATONG ADVANCED MATERIAL CO LTDs patent filings in countries
# Country Total Patents
#1 China 13

Patent filings per year

Chart showing SUZHOU DATONG ADVANCED MATERIAL CO LTDs patent filings per year from 1900 to 2020

Focus industries

Top inventors

# Name Total Patents
#1 Wu Chuanye 8
#2 Ren Tianbin 8
#3 Wang Yongtao 7
#4 Liu Xin 6
#5 An Xiaodong 5
#6 Shi Xiangkai 2
#7 Ou Jie 2
#8 Yang Chao 2
#9 Huang Tao 2
#10 Shi Wei 1

Latest patents

Publication Filing date Title
CN105038664A Anti-corrosion hot melt adhesive of modified pipeline
CN105038692A Double-component transparent adhesive type organic silica gel and preparation method thereof
CN105038697A Adhesive special for solar cell module and preparation method of adhesive
CN105038612A EVA hot melt glue high in heat resistance and strength
CN105017775A Heat conducting and flame retardant pouring sealant
CN105086473A Fluorine-silicon sealant for fuel oil-resisting solvent part and preparation method for fluorine-silicon sealant
CN105086923A Organic silicon pouring sealant for LEDs and preparation method for organic silicon pouring sealant
CN104151498A Preparation method for multi-component composite grafting modification resins used for hot melt adhesive
CN103374213A Preparation method of polylactic acid/montmorillonite nano composite material
CN103374117A Preparation method of heat-resistant degradable resin
CN102816536A Adhesive tape used for solar cell assembly and preparation method thereof
CN102816553A Organosilicon adhesive used for edge sealing of solar cell assembly and preparation method thereof
CN102816552A Organosilicon encapsulating adhesive used for electrical and electronic products, and preparation method thereof