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MATSUDA SEISAKUSHO

Overview
  • Total Patents
    80
  • GoodIP Patent Rank
    180,716
  • Filing trend
    ⇩ 33.0%
About

MATSUDA SEISAKUSHO has a total of 80 patent applications. It decreased the IP activity by 33.0%. Its first patent ever was published in 1975. It filed its patents most often in Japan and China. Its main competitors in its focus markets machines, environmental technology and medical technology are SUZHOU DATONG ADVANCED MATERIAL CO LTD, KEIYO KOGYO KK and SEIEI KK.

Patent filings in countries

World map showing MATSUDA SEISAKUSHOs patent filings in countries
# Country Total Patents
#1 Japan 79
#2 China 1

Patent filings per year

Chart showing MATSUDA SEISAKUSHOs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Nakai Takashi 24
#2 Niwa Mikiya 8
#3 Yoshida Toshinori 6
#4 Sato Setsuo 6
#5 Tokutake Hitoshi 6
#6 Mori Tadashi 5
#7 Matsumoto Shigeru 4
#8 Makabe Tetsuo 4
#9 Uematsu Yoshiyuki 4
#10 Aoyama Setsuo 4

Latest patents

Publication Filing date Title
JP2020076627A Two-axis testing machine
JP2019130642A Cylinder polishing device
JP2019038082A Curved surface polishing device
JP2018016075A Vent device and vent-type injection molding machine
JP2018144187A Pipe inner surface polishing apparatus
JP2018099739A Polishing device
JP2016010918A Material posture changing device, injection molding device using the material posture changing device, and method for feeding material in the injection molding device
JP2014136312A Injection molding device and injection molding method
JP2014136313A Injection molding device and injection molding method
JP2009298050A Mold clamping device
JP2009062703A Metal fitting for door
JP2009034957A Molding device and molding method
JP2006110921A Injection molding machine
JP2006110922A Nozzle for injection molding machine
JP2006057926A Ventilation duct
JP2006043906A Vacuum forming machine
JP2005111757A Vertical injection molding machine
JP2005074970A Mold for injection molding and injection molding machine equipped with the mold
JP2004296822A Housing for communication system
JP2003184397A Locking apparatus for biparting doors