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SUMITOMO METAL ELECTRONICS DEV

Overview
  • Total Patents
    700
About

SUMITOMO METAL ELECTRONICS DEV has a total of 700 patent applications. Its first patent ever was published in 1996. It filed its patents most often in Japan and United States. Its main competitors in its focus markets semiconductors, audio-visual technology and machines are YAMANO TAKAHARU, KANTO SANYO SEMICONDUCTORS CO and NIPPON RETSUKU KK.

Patent filings in countries

World map showing SUMITOMO METAL ELECTRONICS DEVs patent filings in countries
# Country Total Patents
#1 Japan 697
#2 United States 3

Patent filings per year

Chart showing SUMITOMO METAL ELECTRONICS DEVs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Kosakata Akiyoshi 37
#2 Hidaka Akihiro 36
#3 Ogami Ayafumi 27
#4 Itakura Hideaki 26
#5 Kubo Noboru 26
#6 Tomabechi Shigenao 23
#7 Tezuka Masashi 21
#8 Tsukiyama Yoshio 20
#9 Ikeda Takuji 19
#10 Nakai Toshihiro 18

Latest patents

Publication Filing date Title
JP2012184491A Device for mounting ceramic substrate to inner set rack
JP2012138437A Electronic component housing package
JP2012138436A Electronic component housing package
JP2012114383A Ceramic circuit board and package for housing electronic component
JP2012091301A Cutting method of ceramic green sheet
JP2012064616A Storage package for high heat radiation type electronic component
JP2012059948A Ceramic package for housing electronic component
JP2012052827A Warpage inspection apparatus for ceramic substrate
JP2012044000A Substrate for mounting light emitting device
JP2012018943A Electrolytic plating treatment method for multi-piece patterned circuit board
JP2012000875A Screen printing apparatus
JP2011192740A Ceramic substrate
JP2011182039A Transmission line board for high frequency
JP2011167997A Screen printing apparatus
JP2011134958A Method for producing piezoelectric ceramic
JP2011134773A Package for housing semiconductor device
JP2011122980A Semiconductor package inspection device and semiconductor package inspection method
JP2011121807A Method for producing alumina sintered compact
JP2011114031A Ceramic package for storing electronic component
JP2011114032A Ceramic package for storing electronic component