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SUGA TADATOMO

Overview
  • Total Patents
    70
  • GoodIP Patent Rank
    147,769
  • Filing trend
    0.0%
About

SUGA TADATOMO has a total of 70 patent applications. It increased the IP activity by 0.0%. Its first patent ever was published in 1987. It filed its patents most often in Japan, United States and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets semiconductors, machines and machine tools are JIANGSU CHERRITY OPTRONICS CO LTD, JIANGSU CHENGRUIDA PHOTOELECTRIC CO LTD and SHIMOMURA AKIHISA.

Patent filings per year

Chart showing SUGA TADATOMOs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Suga Tadatomo 69
#2 Yamauchi Akira 30
#3 Matsumoto Yoshiie 20
#4 Kondou Ryuichi 10
#5 Ito Hisahiro 8
#6 Azuma Kazuji 5
#7 Saito Keisuke 5
#8 Abe Tomoyuki 4
#9 Oido Yoshihisa 4
#10 Eguchi Shinzo 4

Latest patents

Publication Filing date Title
JP2017216469A Method for bonding substrates having respective metal regions
JP2017088735A Method for manufacturing substrate
EP3136422A1 Substrate-bonding device and method for bonding substrate
JP2015173247A Substrate surface processing device and method, method for bonding substrate, and substrate joining body
JP2015099917A Substrate bonding method and substrate bonded body
JP2015220287A Normal temperature bonding method and device using cluster ion beam
JP2014220415A Substrate surface treatment method and device
US2015048523A1 Chip-on-wafer bonding method and bonding device, and structure comprising chip and wafer
EP2837490A1 Method for bonding polymer film to polymer film or inorganic material substrate, polymer film laminate, and laminate of polymer film and inorganic material substrate
JP2013243333A Chip-on wafer bonding method and bonding device and structure including chip and wafer
JP2013251405A Bonding method of substrate having metal region
JP2013251404A Surface treatment method of chip, bonding method, and surface treatment device
JP2013221175A Method for removing surface oxide using organic acid gas under existence of metal catalyst or inert gas atmosphere, and joining device
KR20140048084A Bonded-substrate fabrication method, bonded substrate, substrate bonding method, bonded-substrate fabrication device, and substrate assembly
EP2672507A1 Bonding-substrate fabrication method, bonding-substrate fabrication apparatus, and substrate assembly
JP2008153682A Electronic parts mounter and its manufacturing method
JP2005079353A Substrate bonding method and device, and irradiation method
JP2004342855A Device and method for bonding substrate
JP2004337927A Substrates joining method and substrates joining device
JP2004327718A Method of mounting electronic component