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SS OTRON CO LTD

Overview
  • Total Patents
    21
  • GoodIP Patent Rank
    81,463
  • Filing trend
    ⇩ 66.0%
About

SS OTRON CO LTD has a total of 21 patent applications. It decreased the IP activity by 66.0%. Its first patent ever was published in 2011. It filed its patents most often in Republic of Korea. Its main competitors in its focus markets semiconductors, measurement and electrical machinery and energy are Suzhou tongfu chaowei semiconductor co ltd, SHENZHEN SI SEMICONDUCTORS CO and OKUMOTO KENJI.

Patent filings in countries

World map showing SS OTRON CO LTDs patent filings in countries
# Country Total Patents
#1 Republic of Korea 21

Patent filings per year

Chart showing SS OTRON CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Shin Gye Chul 15
#2 Shin Ge Chel 6
#3 Kim Sook Hyang 4
#4 Park In Kyu 3
#5 Kim Sang Hoon 3

Latest patents

Publication Filing date Title
KR102194786B1 PCB automatic subdivision device of semiconductor package
KR102114636B1 Process device for semiconductor package
KR102133881B1 Automatic replacement device for tray to jig for semiconductor package
KR102133877B1 Automatic replacement device for jig to boat for semiconductor package
KR102133878B1 Automatic replacement device for jig to tray for semiconductor package
KR101910354B1 Tray automatic replacement device for semiconductor packages
KR101862191B1 A semiconductor manufacturing lid, and a jig for transferring the lid
KR101862195B1 wafer clamp
KR101829277B1 semiconductor package press device
KR101704618B1 Apparatus for Packaging the memory card
KR101680538B1 Aligning Apparatus of Semiconductor
KR101683589B1 Vision inspection apparatus and vision inspection method therefor
KR101697119B1 apparatus for vision inspection of semiconductor
KR101690152B1 Automatic Change Apparatus for Semiconductor fixed cover
KR101667686B1 A map marking and map file forming device for semiconductor packaging
KR101662143B1 Equipment for sticking adhesive tape on semiconductor
KR101627573B1 Internal type antenna inspection apparatus
KR101600294B1 NCP flip chip bonding for silicon carbide heating element heater
KR101521873B1 Tube supply apparatus for semiconductor package fabrication apparatus
KR20160024691A Structure and method for connecting silicon carbide heating element and metallic contact grid