SPUTTERED FILMS INC has a total of 33 patent applications. Its first patent ever was published in 1983. It filed its patents most often in United States, EPO (European Patent Office) and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets surface technology and coating, electrical machinery and energy and machines are ANICON INC, NEW ZEALAND WIRE IND and MURAYAMA YOICHI.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 18 | |
#2 | EPO (European Patent Office) | 4 | |
#3 | WIPO (World Intellectual Property Organization) | 3 | |
#4 | Australia | 2 | |
#5 | Canada | 2 | |
#6 | China | 2 | |
#7 | Japan | 1 | |
#8 | Taiwan | 1 |
# | Industry | |
---|---|---|
#1 | Surface technology and coating | |
#2 | Electrical machinery and energy | |
#3 | Machines | |
#4 | Semiconductors | |
#5 | Chemical engineering |
# | Technology | |
---|---|---|
#1 | Coating metallic material | |
#2 | Electric discharge tubes | |
#3 | Unspecified technologies | |
#4 | Semiconductor devices | |
#5 | Cleaning |
# | Name | Total Patents |
---|---|---|
#1 | Clarke Peter J | 20 |
#2 | Begin Robert George | 9 |
#3 | Felmetsger Valery V | 8 |
#4 | Clarke Andrew P | 4 |
#5 | Laptev Pavel N | 3 |
#6 | Dimock Jack A | 2 |
#7 | Begin Robert G | 1 |
Publication | Filing date | Title |
---|---|---|
US6783638B2 | Flat magnetron | |
US6086947A | Method of depositing materials on a wafer to eliminate the effect of cracks in the deposition | |
US5914017A | Apparatus for, and method of, removing hydrocarbons from the surface of a substrate | |
US6605198B1 | Apparatus for, and method of, depositing a film on a substrate | |
US5830272A | System for and method of providing a controlled deposition on wafers | |
US5766426A | Apparatus for, and method of, depositing a film on a substrate | |
US5310410A | Method for processing semi-conductor wafers in a multiple vacuum and non-vacuum chamber apparatus | |
US5135634A | Apparatus for depositing a thin layer of sputtered atoms on a member | |
US5061360A | Apparatus for depositing a thin film of a sputtered material on a member | |
US4522697A | Wafer processing machine | |
US4523985A | Wafer processing machine |