| # | Country | Total Patents | |
|---|---|---|---|
| #1 | EPO (European Patent Office) | 9 | |
| #2 | Malaysia | 1 | |
| #3 | United States | 1 |
| # | Industry | |
|---|---|---|
| #1 | Machine tools | |
| #2 | Semiconductors | |
| #3 | Civil engineering | |
| #4 | Thermal processes |
| # | Technology | |
|---|---|---|
| #1 | Grinding or polishing devices | |
| #2 | Semiconductor devices | |
| #3 | Air-conditioning | |
| #4 | Finishing work on buildings | |
| #5 | General building constructions |
| # | Name | Total Patents |
|---|---|---|
| #1 | Arai Hatsuyuki | 6 |
| #2 | Izumi Shigeto | 3 |
| #3 | Wang Xu-Jin | 2 |
| #4 | Sugiyama Misuo | 2 |
| #5 | Tanaka Hideo | 2 |
| #6 | Iida Shinya | 1 |
| #7 | Ikeyama Yasushi | 1 |
| #8 | Yoshida Akitoshi | 1 |
| #9 | Hakomori Shunji | 1 |
| #10 | Colley Timothy | 1 |
| Publication | Filing date | Title |
|---|---|---|
| US6102779A | Method and apparatus for improved semiconductor wafer polishing |