SPEEDFAM IPEC CO LTD innovation strategy

Patent filings in countries

#	Industry
#1	Machine tools
#2	Semiconductors
#3	Electrical machinery and energy
#4	Basic materials chemistry
#5	Materials and metallurgy
#6	Thermal processes

#	Technology
#1	Grinding or polishing devices
#2	Semiconductor devices
#3	Electric discharge tubes
#4	Grinding tools
#5	Treatment of glass
#6	Polishing compositions
#7	Materials for miscellaneous applications
#8	Alloys
#9	Air-conditioning

Publication	Filing date	Title
US6451217B1	2000-02-28	Wafer etching method
JP2000068256A	1999-05-12	Method of wafer etching
JP2000308963A	1999-04-27	Single-side lapping device
JP2000308961A	1999-04-26	Affixing plate and manufacture of same
JP2000301452A	1999-04-20	Carrier and cmp device
JP2000296462A	1999-04-14	Backing pad structure
JP2000296459A	1999-04-13	Workpiece polishing method
JP2000296461A	1999-04-13	Backing pad structure
JP2000288923A	1999-04-07	Carrier and cmp device
JP2000294622A	1999-04-02	Wafer holding chuck
JP2000288887A	1999-04-01	Polishing method for edge chamfering part
JP2000263431A	1999-03-15	Multi-layer packing pad
JP2000256094A	1999-03-08	Production of wafer by epitaxial growth of silica and device therefor
JP2000246622A	1999-03-02	Glass surface plate and manufacture thereof
JP2000223479A	1999-03-01	Wafer-flattening system and wafer-flattening method
JP2000237947A	1999-02-19	Dresser
JP2000237955A	1999-02-18	Mechanism for supplying liquid to wafer sucking part of end surface polishing device and for vacuum sucking the wafer
JP2000233354A	1999-02-16	Wafer notch polishing device
JP2000232097A	1999-02-12	Method for planarizing wafer
JP2000218515A	1999-02-04	Polishing machine