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SPEEDFAM CORP

Overview
  • Total Patents
    257
About

SPEEDFAM CORP has a total of 257 patent applications. Its first patent ever was published in 1959. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and Germany. Its main competitors in its focus markets machine tools, semiconductors and machines are UNOVA UK LTD, OBSIDIAN INC and ENERGY ADAPTIVE GRINDING INC.

Patent filings per year

Chart showing SPEEDFAM CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Cesna Joseph V 42
#2 Arai Hatsuyuki 25
#3 Boettcher Stephen A 23
#4 Nagahashi Isao 18
#5 Holzapfel Paul 17
#6 Karlsrud Chris E 15
#7 Karlsrud Chris 14
#8 Kim Inki 14
#9 Maeda Seiichi 10
#10 Natalicio John 9

Latest patents

Publication Filing date Title
WO9956910A1 Polishing apparatus
US6555466B1 Two-step chemical-mechanical planarization for damascene structures on semiconductor wafers
WO9928083A1 Segmented polishing pad
WO9925520A1 Method and apparatus for modeling a chemical mechanical polishing process
JPH1170462A Method and device for chemical and mechanical flattening using micro duplicate surface
US5993293A Method and apparatus for improved semiconductor wafer polishing
US5954888A Post-CMP wet-HF cleaning station
US5997390A Polishing apparatus with improved alignment of polishing plates
US5972162A Wafer polishing with improved end point detection
US5975094A Method and apparatus for enhanced cleaning of a workpiece with mechanical energy
US5957763A Polishing apparatus with support columns supporting multiple platform members
WO9812020A1 Methods and apparatus for uniform polishing of a workpiece
TW339461B Device for conditioning polishing pads utilizing brazed cubic boron nitride technologies
US5916015A Wafer carrier for semiconductor wafer polishing machine
WO9805066A2 Methods and apparatus for the in-process detection and measurement of thin film layers
US6030280A Apparatus for holding workpieces during lapping, honing, and polishing
TW346425B Method and apparatus for conditioning polishing pads utilizing brazed diamond technology
US5834645A Methods and apparatus for the in-process detection of workpieces with a physical contact probe
WO9801892A1 Methods and apparatus for cleaning, rinsing, and drying wafers
US5885312A Grinding composition using abrasive particles on bubbles