SILICONIX INCORPORATED has a total of 26 patent applications. Its first patent ever was published in 1996. It filed its patents most often in United States, EPO (European Patent Office) and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets semiconductors, surface technology and coating and basic communication technologies are HIRLER FRANZ, EPITOP PHOTOELECTRIC TECHNOLOGY CO LTD and ADVANCED POWER DEVICE RES ASS.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 6 | |
#2 | EPO (European Patent Office) | 5 | |
#3 | WIPO (World Intellectual Property Organization) | 5 | |
#4 | China | 3 | |
#5 | Republic of Korea | 3 | |
#6 | Taiwan | 3 | |
#7 | Australia | 1 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Surface technology and coating | |
#3 | Basic communication technologies | |
#4 | Machines |
# | Technology | |
---|---|---|
#1 | Semiconductor devices | |
#2 | Single-crystal-growth | |
#3 | Pulse technique | |
#4 | Unspecified technologies |
# | Name | Total Patents |
---|---|---|
#1 | Terrill Kyle | 12 |
#2 | Shibib M Ayman | 11 |
#3 | Azam Misbah | 6 |
#4 | Udrea Florin | 6 |
#5 | Camuso Gianluca | 6 |
#6 | Longobardi Giorgia | 6 |
#7 | Efthymiou Loizos | 6 |
#8 | Chien Hao-Che | 5 |
#9 | Chen Max | 4 |
#10 | Park Chanho | 4 |
Publication | Filing date | Title |
---|---|---|
US2021083660A1 | Semiconductor device with multiple independent gates | |
US2021043741A1 | Termination for vertical trench shielded devices | |
US2020357755A1 | Transistors with electrically active chip seal ring and methods of manufacture | |
US2020312657A1 | Virtual wafer techniques for fabricating semiconductor devices | |
WO2020185193A1 | Semiconductor package having side wall plating | |
WO2020185192A1 | Semiconductor package having side wall plating | |
US2020243656A1 | Split gate semiconductor with non-uniform trench oxide | |
US2019267456A1 | Power semiconductor device with optimized field-plate design |