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OSAKA DIAMOND IND

Overview
  • Total Patents
    246
About

OSAKA DIAMOND IND has a total of 246 patent applications. Its first patent ever was published in 1974. It filed its patents most often in Japan, EPO (European Patent Office) and United States. Its main competitors in its focus markets machine tools, machines and semiconductors are EHWA DIAMOND IND CO LTD, TUSCH KG DIAMANT and PROWSE CO LTD D H.

Patent filings per year

Chart showing OSAKA DIAMOND INDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Nishimura Kazuhito 25
#2 Fukunishi Toshio 23
#3 Hara Akio 21
#4 Oshita Hideo 20
#5 Koroku Shuichiro 19
#6 Okanishi Yukio 18
#7 Yamanaka Masaaki 17
#8 Shimaoka Hiroyuki 17
#9 Yoshinaga Hirotoshi 17
#10 Oka Yukitsugu 16

Latest patents

Publication Filing date Title
JP2001009730A Super-abrasive grain tool
JP2001038630A Superfine abrasive grain tool, and its manufacture
JP2001054850A Hard brittle material cutting method by means of fixed abrasive grain wire saw
JP2000167769A Dresser using gas phase synthetic diamond
JP2001001266A Super abrasive grain cutting wheel
JP2001018172A Correcting tool for polishing tool
JP2001009729A Superabrasive grain cutting wheel
JP2000343420A Extra-abrasive grain lapping surface table
JP2000025031A Spot-facing method of building material with chain saw blade
JP2000334664A Super-abrasive grain blade and manufacture thereof
JP2000326234A Super-abrasive grain wheel for deburring
JP2000317846A Super abrasive grain cutting wheel
JP2000317845A Super abrasive grain blade
JP2000308971A Super-abrasive grain cutting wheel
JP2000288804A Diamond cutting tool
JP2000288903A Surface grinding method and surface grinding device using multiwire saw
JP2000271870A POROUS SUPER ABRASIVE GRAIN THIN BLADE CUTTING WHEEL CONTAINING TiC COAT SUPER ABRASIVE GRAIN
JP2000271872A Super abrasive grain resin bond wire saw
JP2000263452A Super-abrasive grain wire saw
JP2000246542A Resin bond super abrasive grain wire saw