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SILECS OY

Overview
  • Total Patents
    68
  • GoodIP Patent Rank
    218,010
About

SILECS OY has a total of 68 patent applications. Its first patent ever was published in 2002. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and EPO (European Patent Office). Its main competitors in its focus markets semiconductors, macromolecular chemistry and polymers and basic materials chemistry are RANTALA JUHA T, SANYU REC CO LTD and ASANO MASATOSHI.

Patent filings per year

Chart showing SILECS OYs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Rantala Juha T 32
#2 Paulasaari Jyri 29
#3 Rantala Juha 27
#4 Maaninen Arto L T 12
#5 Pietikaeinen Jarkko 9
#6 Kylmae Janne 7
#7 Pietikainen Jarkko J 7
#8 Maaninen Tiina J 7
#9 Tormanen T Teemu T 7
#10 Reid Jason 6

Latest patents

Publication Filing date Title
WO2012172177A1 Organometallic monomers and high refractive index polymers derived therefrom
TW201245353A Method of producing highly conformal coatings
FI20115628A0 A novel polymer composition and process for its preparation
EP2553145A1 Etch resistant alumina based coatings
TW201133600A Etch resistant alumina based coatings
TW200844180A High silicon content siloxane polymers for integrated circuits
TW200927835A Novel nanoparticle containing siloxane polymers
US2008188032A1 Nanoparticle containing siloxane polymers
TW200807705A Semiconductor optoelectronics devices
CN101044604A Novel polyorganosiloxane dielectric materials
KR20060127905A Adamantyl monomers and polymers for low-k-dielectric applications
US7098346B2 Methods and compounds for making coatings, waveguides and other optical devices
FI20041139A0 Polyorganosiloxane-based dielectric materials and semiconductor devices containing these
US7161019B2 Methods and compounds for making coatings, waveguides and other optical devices
WO2004090936A2 Low-k dielectric material
US2006180900A1 Organo-silsesquioxane polymers for forming low-k dielectrics
US7622399B2 Method of forming low-k dielectrics using a rapid curing process
FI20031906A0 Monomers and polymers for low K dielectric applications
FI20031905A0 Organosilsesquioxane polymers for the production of low K dielectrics
FI20031043A0 Low k value insulation materials