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SII SEMICONDUCTOR CORP

Overview
  • Total Patents
    794
  • GoodIP Patent Rank
    2,259
  • Filing trend
    ⇩ 95.0%
About

SII SEMICONDUCTOR CORP has a total of 794 patent applications. It decreased the IP activity by 95.0%. Its first patent ever was published in 2003. It filed its patents most often in Taiwan, Japan and United States. Its main competitors in its focus markets semiconductors, electrical machinery and energy and measurement are ABLIC INC, SATO TETSUO and GUANGDONG GREATER BAY AREA INST OF INTEGRATED CIRCUIT AND SYSTEM.

Patent filings per year

Chart showing SII SEMICONDUCTOR CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Goto Katsuya 54
#2 Kawano Akihiro 44
#3 Ebihara Mika 36
#4 Hioka Takaaki 32
#5 Utsunomiya Fumiyasu 31
#6 Ariyama Minoru 30
#7 Takada Kosuke 29
#8 Sugiura Masakazu 27
#9 Maetani Fumihiko 22
#10 Mitani Makoto 21

Latest patents

Publication Filing date Title
US2018172771A1 Secondary battery monitoring device and method for diagnosing failure
CN108258751A Charge-discharge control circuit and cell apparatus
CN107799498A The manufacture method of semiconductor device
US2018062410A1 Charge/discharge control circuit and battery device including the same
US2018059193A1 Sensor circuit
US2018062631A1 Semiconductor device
US2018047858A1 Method of manufacturing a semiconductor device
JP2018026536A Method of manufacturing semiconductor device
US2017336445A1 Zero-crossing detection circuit and sensor device
JP2017211365A Zero-cross detecting circuit and sensor device
CN107167164A Magnetic Sensor and magnet sensor arrangement
JP2017161505A Magnetic sensor and magnetic sensor device
JP2017010607A Nonvolatile semiconductor storage circuit
JP2018040752A Probe card and probe needle
US2017155255A1 Charging/discharging control circuit and battery apparatus including voltage or current detection for secondary batteries
JP2018029307A Microphone
JP2018026453A Polishing head, cmp polishing device having polishing head, and manufacturing method of semiconductor integrated circuit device using the same
JP2018026452A Mold device and manufacturing method of semiconductor device using the same
JP2018026451A Semiconductor device
JP2018023231A Charge/discharge control circuit and battery device with the same