Electrical multiple layer component module used in polymer stud grid array technology comprises a second three-dimensional substrate arranged on first three-dimensional substrate with intermediate connections connected to contacts
DE10225685A1
Forming holes in a flat polymer material circuit board substrate, involves initially forming blind holes, and then removing the material at the bottom using a laser
DE10225431A1
Method for connecting electronic components on an insulating substrate and component module produced by the method
DE10223203A1
Electronic component module and method for its production
DE10207290A1
Production of a connecting support with a flat substrate comprises providing the substrate with a conductor strip structure on both sides, forming inner connections in the assembly region for contacting a component and further processing
DE10202923A1
Process for drilling holes in connecting support for electrical components includes coating support with heat resistant material and removing and vaporizing and/or liquefying coating material and support material in the hole to be drilled
DE10202145A1
Production of connecting substrates comprises laminating substrate film made from polymer with metal layer on one side, forming bumps and recesses on one side of the substrate foil, covering the surface with metal layer and structuring
DE10201643A1
Connection carrier for electronic component has carrier body with holding elements on at least two opposing edge regions for aligning and holding the component in a desired position
DE10162992A1
Plug socket used for miniaturized electrical components includes a base of elastic insulating material with a connecting side for contact on a connection support, a plug channel, and an insulating contact hub
EP1215604A2
Method for ordering and shipment of items
DE10148226C1
Device for separating flat mail items in thickness classes
EP1235167A2
Closed loop electronic factoring
DE10147922A1
Placement head for holding components
EP1298551A1
Overcoming null deliveries
EP1310917A2
Method of providing mail piece franking
DE10147106A1
Placement device and method for equipping substrates with placement elements
EP1296257A1
Electronic cash on delivery
DE10146587A1
Handling device for placement elements, placement system and method for placement on substrates
DE10146529A1
Method for controlling a sorting machine for flat items
DE10145348C1
Intermediate carrier for electronic component has suction used for removal of excess solder at foot of contact projections formed integral with plastics carrier body
