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SHINHANDIAMONDINDUSTRIAL CO LTD

Overview
  • Total Patents
    43
  • GoodIP Patent Rank
    173,404
  • Filing trend
    ⇩ 100.0%
About

SHINHANDIAMONDINDUSTRIAL CO LTD has a total of 43 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2008. It filed its patents most often in Republic of Korea, China and EPO (European Patent Office). Its main competitors in its focus markets machine tools, machines and semiconductors are SHINHAN DIAMOND IND CO LTD, JIANGSU MEIJIE ABRASIVE TECH CO LTD and LISSMAC MASCHINENBAU GMBH.

Patent filings in countries

World map showing SHINHANDIAMONDINDUSTRIAL CO LTDs patent filings in countries

Patent filings per year

Chart showing SHINHANDIAMONDINDUSTRIAL CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Kim Shin Kyung 30
#2 Park Mun Seak 14
#3 Kim Jeong 13
#4 Song Brian 12
#5 Byun Sung Keun 10
#6 Kim Kang Jun 10
#7 Choi Young Il 8
#8 Kim Kyoung Jin 7
#9 Jung Tae Soon 7
#10 Jang Myung Hun 6

Latest patents

Publication Filing date Title
KR20210008713A CMP MANUFACTURING METHOD AND CMP PAD Conditioner USING THE SAME
KR20190047159A High speed rotating composite tool and manufacturing method thereof
KR20180038244A Attachment removing device for diamond tool
KR20160147443A Saw blade with noise and stress reducing structure
KR101418804B1 Scriber holder
KR101419342B1 Scriber holder
KR20140032470A Dispenser structure
KR20140006277A Cmp pad conditioner and its manufacturing method
KR20130063106A Dispenser structure
KR20130010536A Cutter blade
KR101122136B1 Compression molding type encapsulation material forming apparatus
KR20130007179A Cmp pad conditioner and its manufacturing method
KR20120113835A The drill bit to form the pattern to diamond particles
KR101052324B1 Encapsulation material forming method
KR20120102232A Cmp pad conditioner disc
KR20120102231A Cmp pad conditioner
KR20120052007A Scriber holder
KR101087031B1 Encapsulation material forming apparatus and method
KR20120040494A Apparatus for forming encapsulation material in electronic element
KR20120031729A Method for manufacturing cmp pad conditioner using bulk metallic glass