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MEMC JAPAN LTD

Overview
  • Total Patents
    19
About

MEMC JAPAN LTD has a total of 19 patent applications. Its first patent ever was published in 2000. It filed its patents most often in Japan. Its main competitors in its focus markets machine tools, semiconductors and surface technology and coating are GEOSCIENCE INSTR CORP, KINIK CO LTD and FLEX TRIM AS.

Patent filings in countries

World map showing MEMC JAPAN LTDs patent filings in countries
# Country Total Patents
#1 Japan 19

Patent filings per year

Chart showing MEMC JAPAN LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Katano Taku 4
#2 Hatsuda Ryota 3
#3 Inaba Akihiro 3
#4 Haga Hirotsugu 3
#5 Kojima Shin 3
#6 Yoshimura Ichiro 2
#7 Yamazaki Tomotsugu 2
#8 Aoyama Yuki 2
#9 Ikeda Kiyotoshi 1
#10 Mohsen Banan 1

Latest patents

Publication Filing date Title
JP2009130321A Method of polishing semiconductor wafer
JP2008239398A Device for collecting impurity at edge part of wafer-shaped material, device for cleaning and etching the material and method using the device
JP2004050313A Abrasive wheel and grinding method
JP2003127057A Ingot cutting method with less wire flying
JP2003100759A Method for manufacturing epitaxial silicon wafer
JP2003100681A Final polishing pad
JP2003094431A Method for cutting a plurality of ingots
JP2002367949A Method for cleaning silicon wafer
JP2002283340A Ingot cutting method
JP2002246349A Method and equipment for polishing and cleaning silicon wafer
JP2002226293A Method for growing silicon single crystal
JP2002174593A Method for evaluating single-crystal ingot, and method for cutting single crystal ingot using the same
JP2002093814A Substrate single crystal of silicon epitaxial wafer, and its manufacturing method
JP2002018703A Method and device for heating polishing block, and heating plate used therefor
JP2002001636A Chamfering method for wafer
JP2001334448A Multi-step chamfering method for wafer
JP2001334452A Cutting method for columnar work
JP2001316198A Method of growing silicon single crystal
JP2001267292A Manufacturing method of wafers