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SHENZHEN WINS SEMICONDUCTOR RES INSTITUTE

Overview
  • Total Patents
    17
  • GoodIP Patent Rank
    98,384
About

SHENZHEN WINS SEMICONDUCTOR RES INSTITUTE has a total of 17 patent applications. Its first patent ever was published in 2019. It filed its patents most often in China. Its main competitors in its focus markets semiconductors, environmental technology and measurement are CHUMAKOV DMYTRO, SHENZHEN 3RD GENERATION SEMICONDUCTOR RES INST and CHANGZHOU GALAXY CENTURY MICRO ELECTRONICS CO LTD.

Patent filings in countries

World map showing SHENZHEN WINS SEMICONDUCTOR RES INSTITUTEs patent filings in countries
# Country Total Patents
#1 China 17

Patent filings per year

Chart showing SHENZHEN WINS SEMICONDUCTOR RES INSTITUTEs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Zhang Guoqi 15
#2 Ye Huaiyu 15
#3 Liu Xu 4
#4 Zhang Xinhe 4
#5 Wen Zhengxin 4
#6 Zhang Weihong 3
#7 Aorigeli 3
#8 Chen Shishi 3
#9 Han Fei 2
#10 Zhang Wei 2

Latest patents

Publication Filing date Title
CN110911536A Micro-LED chip and manufacturing method thereof
CN111024745A Method for measuring and calculating doping concentration of high-doped semiconductor
CN110773908A Preparation method and sintering method of low-temperature sintered indium-doped nano-silver sintering paste
CN110808297A AlGaN/GaN heterojunction-based position sensor, preparation method and detection method
CN110783218A Triaxial type test method for doping concentration of silicon carbide epitaxial wafer
CN110783450A Magnetic field sensor based on gallium nitride/aluminum gallium nitrogen heterojunction
CN110729177A Cleaning method for effectively removing particle agglomeration on front and back surfaces of wafer
CN110729394A Negative resistance type GaN pressure sensor and preparation method thereof
CN110729364A Method for improving optical switching frequency of GaN ultraviolet detector
CN110729354A Silicon carbide transverse MOSFET device and preparation method thereof
CN110690320A Double-junction SiC device and preparation method thereof
CN110534559A A kind of sic semiconductor device terminal and its manufacturing method
CN110284210A A kind of inside has the flexible extensible fiber and the preparation method and application thereof of micro-structure
CN110125386A A kind of forming method, low-temperature sintering copper cream and the sintering process using it of the copper particle of surface progress anti-oxidation protection
CN110002427A A kind of high thermal conductivity carbon film and preparation method thereof
CN110071050A A kind of chip interconnection structure and preparation method thereof
CN110071079A A kind of power device packaging structure and its method