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SENODIA TECHNOLOGIES SHANGHAI CO LTD

Overview
  • Total Patents
    31
  • GoodIP Patent Rank
    173,517
About

SENODIA TECHNOLOGIES SHANGHAI CO LTD has a total of 31 patent applications. Its first patent ever was published in 2009. It filed its patents most often in China, Singapore and Taiwan. Its main competitors in its focus markets measurement, semiconductors and micro-structure and nano-technology are TRIAD SENSORS INC, DILLBERG GUSTAF and ACAR CENK.

Patent filings in countries

World map showing SENODIA TECHNOLOGIES SHANGHAI CO LTDs patent filings in countries

Patent filings per year

Chart showing SENODIA TECHNOLOGIES SHANGHAI CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Zou Bo 12
#2 Fu Shi 5
#3 Guo Meihan 4
#4 Zhao Ling 3
#5 Luo Hao 3
#6 Hua Yaping 2
#7 Li Li 2
#8 Yuan Qiuchun 2
#9 Jie Chen 2
#10 Wang Hui 2

Latest patents

Publication Filing date Title
CN104333344A Oscillation control method for micromechanical resonator and micromechanical resonator
CN104199655A Audio switching method, microprocessor and earphones
CN104089613A Capacitor-type gyroscope sensitive-end capacitor configuration device and configuration method
CN104083856A Ball capable of detecting moving postures
CN104091765A Packaging method targeted for MEMS inertial device semiconductor
CN104077828A Door access control system of non-contact signature
CN104080022A Drive-by-wire earphone with posture control
CN103619090A System and method of automatic stage lighting positioning and tracking based on micro inertial sensor
CN103528577A Z-axis MEMS capacitive gyroscope
CN103576859A Man-machine interaction method for mobile terminal browsing
CN103411864A MEMS sensor for measuring gas suspended particle concentration based on structural resonance
CN103400801A Vacuum encapsulation CMOS (complementary metal-oxide-semiconductor transistor) and MEMS (micro electronic mechanical system) chip and processing method of vacuum encapsulation CMOS and MEMS chip
CN103359680A Vacuum-packaged ultrathin MEMS chip and processing method thereof
CN103411595A Gyroscope of single-shaft micro electro mechanical system
CN103269400A Method for turning over system screen of mobile communication equipment
CN103922267A Inertial sensor production and wafer level package process based on MEMS (micro-electromechanical system)
CN102795593A Method for processing ultrathin vacuum-sealed MEMS (Micro-electromechanical System) wafer
CN102657342A Method for separating egg yolk from egg white
CN102664995A Method for preventing misoperation in conversation of touch-screen cellphone
CN102610211A System and method for adaptively adjusting parameters of display equipment