| # | Country | Total Patents | |
|---|---|---|---|
| #1 | China | 3 | |
| #2 | Republic of Korea | 3 | |
| #3 | United States | 3 | |
| #4 | Taiwan | 2 | |
| #5 | WIPO (World Intellectual Property Organization) | 2 |
| # | Industry | |
|---|---|---|
| #1 | Machine tools | |
| #2 | Machines | |
| #3 | Semiconductors |
| # | Name | Total Patents |
|---|---|---|
| #1 | Bajaj Rajeev | 10 |
| #2 | Rajeev Bajaj | 3 |
| #3 | Narayanswami Natraj | 1 |
| #4 | Nguyen Bang C | 1 |
| Publication | Filing date | Title |
|---|---|---|
| CN102083586A | Polishing pad composition and method of manufacture and use | |
| US2008248734A1 | Method and apparatus for improved chemical mechanical planarization and CMP pad | |
| US2007131564A1 | Electro-chemical mechanical planarization pad with uniform polish performance |