SANYO SILICON DENSHI KK has a total of 14 patent applications. Its first patent ever was published in 1985. It filed its patents most often in Japan, Republic of Korea and Taiwan. Its main competitors in its focus markets audio-visual technology, semiconductors and machines are OSAKA SHINKU KAGAKU KK, NIPPON AVIONICS CO LTD and ADVANCED SYSTEMS AUTOMATION LI.
# | Country | Total Patents | |
---|---|---|---|
#1 | Japan | 12 | |
#2 | Republic of Korea | 1 | |
#3 | Taiwan | 1 |
# | Industry | |
---|---|---|
#1 | Audio-visual technology | |
#2 | Semiconductors | |
#3 | Machines | |
#4 | Thermal processes |
# | Technology | |
---|---|---|
#1 | Casings and printed circuits | |
#2 | Semiconductor devices | |
#3 | Shaping of plastics | |
#4 | Air-conditioning |
# | Name | Total Patents |
---|---|---|
#1 | Fukuda Sadao | 4 |
#2 | Wakabayashi Masaaki | 3 |
#3 | Sakai Masaaki | 3 |
#4 | Ueno Tomio | 2 |
#5 | Hirose Yoshitaka | 1 |
#6 | Miyagi Fumio | 1 |
#7 | Sugaya Haruki | 1 |
#8 | Wakabayashi Takaaki | 1 |
#9 | Shimizu Hiroshi | 1 |
#10 | Yanagi Toshio | 1 |
Publication | Filing date | Title |
---|---|---|
JPH0888306A | Lead-shape correction apparatus for electronic component | |
JPH07178762A | Resin molding method and metal mold | |
JPH06237490A | Power socket device | |
JPH06178361A | Remote control system | |
JPH06163782A | Bend correction apparatus of ic lead | |
JPH06106567A | Resin sealing molding device | |
JPH06106560A | Electronic part sealing mold | |
JPH05316570A | Radio remote control system | |
JPH05316569A | Remote control system | |
JPH0582690A | Ic lead flatness correcting apparatus | |
JPH01120833A | Automatic loader of lead frame | |
JPS6298133A | Humidity regulating device utilizing solution of non-volatile solute |