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REC WAFER NORWAY AS

Overview
  • Total Patents
    35
About

REC WAFER NORWAY AS has a total of 35 patent applications. Its first patent ever was published in 2009. It filed its patents most often in United Kingdom, WIPO (World Intellectual Property Organization) and Taiwan. Its main competitors in its focus markets machines, semiconductors and surface technology and coating are SOLAR GMBH DEUTSCHE, JIANGSU MEIKE SILICON ENERGY CO LTD and JIANGSU GAOZHAO NEW ENERGY DEV CO LTD.

Patent filings in countries

World map showing REC WAFER NORWAY ASs patent filings in countries

Patent filings per year

Chart showing REC WAFER NORWAY ASs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Sauar Erik 13
#2 Homayonifar Pouria 11
#3 Sannes Stian 11
#4 Vladimirov Egor 7
#5 Teixeira Alexandre 6
#6 Menon Mohan 5
#7 Johansen Kai 4
#8 Bakke Per 4
#9 Aas Kristian L 3
#10 Andersen Torgrim 3

Latest patents

Publication Filing date Title
GB201208611D0 Improved production of monocrystalline silicon
GB201120696D0 Production of mono-crystalline silicon
GB201120083D0 Detection of solid-liquid interfaces in the production of crystalline silicon
GB201112610D0 Heating a furnace for the growth of semiconductor material
GB201111735D0 Furnace for semiconductor material and method
GB201106559D0 Directional solidification apparatus
GB201106558D0 Directional solidification furnace
GB201103420D0 On-line testing for mechanical stability of sheet material by applying twist
TW201133594A Cleaning stack of wafers
CN102859049A Method for production of semiconductor grade silicon ingots, reusable crucibles and method for manufacturing them
GB201017049D0 Abrasive slurry and method of production of photovoltaic wafers
GB201016618D0 Support for block
GB201005399D0 Reusable crucible
GB0922741D0 Method for cutting a block of silicon into wafers
GB0922708D0 Process for cutting a block using a planar array of wires
GB0922363D0 Cleaning a stack of thin wafers
GB0916339D0 Process for cutting a multiplicity of wafers
GB0916340D0 Sawing of blocks into wafers
GB0905059D0 Apparatus for cutting wafers using wires and abrasive slurry