QING DING PREC ELECTRONICS HUAIAN CO LTD has a total of 19 patent applications. Its first patent ever was published in 2018. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and China. Its main competitors in its focus markets audio-visual technology, telecommunications and semiconductors are QINGDING PREC ELECTRONICS HUAIAN CO LTD, FUKUI PREC COMPONENT (SHENZHEN) CO LTD and SIMMTECH CO LTD.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 10 | |
#2 | WIPO (World Intellectual Property Organization) | 7 | |
#3 | China | 2 |
# | Industry | |
---|---|---|
#1 | Audio-visual technology | |
#2 | Telecommunications | |
#3 | Semiconductors | |
#4 | Machines | |
#5 | Electrical machinery and energy | |
#6 | Basic materials chemistry | |
#7 | Surface technology and coating |
# | Technology | |
---|---|---|
#1 | Casings and printed circuits | |
#2 | Semiconductor devices | |
#3 | Antennas | |
#4 | Unspecified technologies | |
#5 | Layered products | |
#6 | Adhesives | |
#7 | Electrically-conductive connections |
# | Name | Total Patents |
---|---|---|
#1 | Ho Ming-Jaan | 4 |
#2 | Ho Mingjaan | 4 |
#3 | Hou Ning | 3 |
#4 | Li Biao | 3 |
#5 | Gao Lin-Jie | 3 |
#6 | Liu Ruiwu | 2 |
#7 | Yang Yong-Quan | 2 |
#8 | Peng Man-Zhi | 2 |
#9 | Yeh Tzu-Chien | 2 |
#10 | Shen Fuyun | 2 |
Publication | Filing date | Title |
---|---|---|
WO2021056427A1 | Interposer, manufacturing method therefor, and circuit board assembly | |
WO2021035762A1 | Circuit board having heat-dissipation structure and preparation method therefor | |
US2021036416A1 | Antenna module and method for manufacturing the same | |
WO2020237672A1 | Flexible circuit board and manufacture method therefor | |
WO2020215224A1 | Adapter plate and manufacturing method therefor | |
US2020137894A1 | Method of manufacturing circuit board | |
WO2020093400A1 | Rigid-flex circuit board and manufacturing method therefor | |
CN111527798A | Embedded circuit board and manufacturing method thereof |