| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 3 | |
| #2 | Germany | 2 | |
| #3 | EPO (European Patent Office) | 2 | |
| #4 | Mexico | 2 | |
| #5 | WIPO (World Intellectual Property Organization) | 2 | |
| #6 | Canada | 1 | |
| #7 | China | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Audio-visual technology | |
| #3 | Measurement | |
| #4 | Micro-structure and nano-technology | |
| #5 | Environmental technology |
| # | Name | Total Patents |
|---|---|---|
| #1 | Kurzeja Dietmar | 11 |
| #2 | Morgenthaler Frédéric | 5 |
| #3 | Morgenthaler Frederic | 1 |
| #4 | Frédéric Morgenthaler | 1 |
| #5 | Dietman Kurzeja | 1 |
| #6 | Dietmar Kurzeja | 1 |
| Publication | Filing date | Title |
|---|---|---|
| CN109863595A | For electronic component, in particular for the shell of semiconductor chip | |
| MX2018005866A | Conductor structure having a component received in a vibration-damped manner. | |
| DE102016011934A1 | Housing for an electronic component, in particular a semiconductor chip | |
| DE102015014593A1 | Printed circuit board structure with a vibration-damped received component |