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ENTORIAN TECHNOLOGIES LP

Overview
  • Total Patents
    49
About

ENTORIAN TECHNOLOGIES LP has a total of 49 patent applications. Its first patent ever was published in 2003. It filed its patents most often in United States. Its main competitors in its focus markets audio-visual technology, semiconductors and computer technology are CLOVER DENSHI KOGYO KK, IWAKI ELECTRON CORP LTD and OIGAWA ELECTRIC CO.

Patent filings in countries

World map showing ENTORIAN TECHNOLOGIES LPs patent filings in countries
# Country Total Patents
#1 United States 49

Patent filings per year

Chart showing ENTORIAN TECHNOLOGIES LPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Goodwin Paul 22
#2 Wehrly Jr James Douglas 22
#3 Partridge Julian 13
#4 Wilder James 11
#5 Roper David L 10
#6 Szewerenko Leland 9
#7 Cady James W 9
#8 Wolfe Mark 7
#9 Rapport Russell 6
#10 Wehrly James Douglas Jr 4

Latest patents

Publication Filing date Title
US2009309214A1 Circuit Module Turbulence Enhancement
US2007258217A1 Split core circuit module
US2008291747A1 Buffered memory device
US2008093734A1 High density IC module
US2008093724A1 Stackable micropackages and stacked modules
US2007158795A1 Memory card and method for devising
US2008122054A1 Circuit module having force resistant construction
US2007290314A1 Contrast interposer stacking system and method
US2007290312A1 Carrier structure stacking system and method
US2007290313A1 Interposer stacking system and method
US2007159545A1 Managed memory component
US2007158802A1 Memory card and method for devising
US2006198238A1 Modified core for circuit module system and method
US2007176286A1 Composite core circuit module system and method
US2006129888A1 Circuit module turbulence enhancement systems and methods
US2006125067A1 Flex circuit constructions for high capacity circuit module systems and methods
US2007170561A1 Stacked integrated circuit module
US2006090102A1 Circuit module with thermal casing systems
US2007103877A1 Flex circuit apparatus and method for adding capacitance while conserving circuit board surface area
US2006092614A1 Stacked module systems