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POLYMATECH JAPAN CO LTD

Overview
  • Total Patents
    110
  • GoodIP Patent Rank
    16,910
  • Filing trend
    ⇩ 100.0%
About

POLYMATECH JAPAN CO LTD has a total of 110 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2010. It filed its patents most often in WIPO (World Intellectual Property Organization), China and Japan. Its main competitors in its focus markets macromolecular chemistry and polymers, audio-visual technology and computer technology are FUJI POLYMER IND, SHENZHEN ACAD OF AEROSPACE TECH and DONGHYUN ELECTRONICS CO LTD.

Patent filings in countries

World map showing POLYMATECH JAPAN CO LTDs patent filings in countries

Patent filings per year

Chart showing POLYMATECH JAPAN CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Watanabe Yasuyoshi 15
#2 Ohsawa Yuta 13
#3 Honmatsu Yoshifumi 10
#4 Kitada Gaku 8
#5 Yamazaki Kota 8
#6 Takeuchi Akihito 8
#7 Konno Hideaki 7
#8 Kudoh Hiroki 7
#9 Tomooka Shinichi 6
#10 Tateda Shinya 6

Latest patents

Publication Filing date Title
WO2017204341A1 Push-button switch
CN109153842A Encapulant composition and sealing material
CN108781524A Thermally conductive sheet
WO2017169421A1 Flexible circuit board and method for manufacturing flexible circuit board
WO2017047519A1 Elastic wiring member
WO2016208458A1 Thermally conductive sheet
CN109196052A The manufacturing method of conducting-heat elements, thermally conductive composition and thermally conductive composition
JP2017212115A Key sheet and push-button switch
US2018163112A1 Thermally conductive sheet
WO2016185936A1 Thermally conductive composition and thermally conductive paste
JP2017199573A Elastic connector and conductive connection structure of elastic connector
WO2016175052A1 Buffering member and wearable device
WO2017179160A1 Unmanned aircraft vibration-damping structure
CN107251662A The manufacture method of circuit wafer and circuit wafer
WO2016136496A1 Elastic connector
WO2016121563A1 Thermally conductive composition
JP2017126595A Sealant and seal-material composition
WO2016104074A1 Thermally conductive sheet
JP2017050515A Film substrate and seam connection structure for film substrate
JP2017048286A Heat conductive sheet