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FUJI POLYMER IND

Overview
  • Total Patents
    333
  • GoodIP Patent Rank
    22,979
  • Filing trend
    ⇧ 62.0%
About

FUJI POLYMER IND has a total of 333 patent applications. It increased the IP activity by 62.0%. Its first patent ever was published in 1968. It filed its patents most often in Japan, United States and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets macromolecular chemistry and polymers, semiconductors and machines are DONGHYUN ELECTRONICS CO LTD, SAGA YUJI and SUZHOU CITY XIANGCHENG DISTR MINGDA COMPOSITE MATERIAL FACTORY.

Patent filings per year

Chart showing FUJI POLYMER INDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Ninomiya Yamahito 56
#2 Funahashi Hajime 47
#3 Koizumi Masakazu 33
#4 Kitayama Nobuyuki 27
#5 Hattori Masakazu 22
#6 Suzumura Katsuyuki 16
#7 Fujimoto Michihiro 15
#8 Fujimoto Mitsuhiro 13
#9 Ogawa Toshiki 13
#10 Tanaka Jinya 13

Latest patents

Publication Filing date Title
WO2021059567A1 Heat transfer sheet for sealing materials and heat-generating electrical/electronic component in which same is incorporated
EP3792305A1 Heat-tolerant thermally conductive composition and heat-tolerant thermally conductive sheet
WO2020250493A1 Thermally conductive electromagnetic-wave-absorbing composition and sheet of same
WO2020137086A1 Heat-conductive composition and heat-conductive sheet employing same
US2021070952A1 Heat-conductive sheet and method for manufacturing same
CN111919292A Thermal conductive sheet and method for producing same
WO2020129335A1 Thermally conductive silicone rubber composition, sheet thereof, and production method therefor
US2020176350A1 Heat-conductive sheet, mounting method using same and bonding method using same
JP2020155682A Heat-conducting silicone sheet and mounting method by use thereof
WO2019098290A1 Two-step curable thermally conductive silicone composition and method for producing same
JP2020007463A Addition curable raw material composition
DE102018112683A1 Method and device for producing a radially oriented magnetorheological elastomer molded body
JP2019169692A Silicone sheet and mounting method using the same
GB201805441D0 Silicone sheet and mounting method using the same
JP2018092901A Stacking type connector and method of manufacturing the same
JP2018170357A Thermally conductive sheet
JP2018123200A Heat-resistant heat-conductive silicone composition
JP2017179338A Magnetic viscoelastic elastomer composition, manufacturing method therefor, and vibration absorbing device having the same
JP2018015904A Composite sheet and method producing the same
JP2017206624A Normal temperature thermally conductive and high temperature adiabatic composition