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PFAFF WAYNE

Overview
  • Total Patents
    36
About

PFAFF WAYNE has a total of 36 patent applications. Its first patent ever was published in 1970. It filed its patents most often in United States, Japan and France. Its main competitors in its focus markets audio-visual technology, measurement and semiconductors are SHINANO ELECTRONICS KK, ASIA ELECTRONICS and R&D CIRCUITS INC.

Patent filings in countries

World map showing PFAFF WAYNEs patent filings in countries

Patent filings per year

Chart showing PFAFF WAYNEs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Pfaff Wayne K 31
#2 Wayne K Pfaff 2

Latest patents

Publication Filing date Title
JP2003051358A Installation device for testing surface-mounting device package
KR20030009769A Test mounting for surface mount device packages
MXPA01007233A Testing assembly for packages of devices mounted on surfaces.
GB0116374D0 Test mounting for surface mount device packages
JP2003014813A Mounting apparatus for high-frequency device package
JP2002040097A Testing mount for grid array package
DE19814164A1 Carrier in chip size
FR2762151A1 Connection strip for burning in and testing semiconductor chips, etc.
JPH11233217A Fixture for grid arrangement package
FR2721145A1 Apparatus for mounting a device comprising a grid network for ball-shaped terminals for testing electronic circuits.
MY138633A Mounting apparatus for ball grid array device
US5108302A Test socket
US4950980A Test socket for electronic device packages
US4869674A Cradle for electronic device package
US4808119A Zero insertion force mounting housings for electronic device packages
US4767983A Test fixture for electronic device packages
US4713022A Socket for flat pack electronic device packages
US4660282A Method and apparatus for unloading electronic circuit packages from zero insertion force sockets
US4618199A Low insertion force socket
US4491377A Mounting housing for leadless chip carrier