NIHON DENNETSU KEIKI CO LTD innovation strategy

Patent filings in countries

#	Country	Total Patents
#1	Japan	121
#2	EPO (European Patent Office)	4

#	Technology
#1	Casings and printed circuits
#2	Soldering, welding and flame cutting
#3	Climate change mitigation in goods production
#4	Systems controlling non-electric variables

Publication	Filing date	Title
JP2008171994A	2007-01-11	Flow-dip soldering machine
JP2007073994A	2006-12-01	Method of soldering printed circuit board by steam atmosphere
JP2008124332A	2006-11-14	Soldering method, soldering system, and fluxing coating system
JP2007036288A	2006-10-12	Flux coating system
JP2008060501A	2006-09-04	Flow soldering apparatus
JP2008060502A	2006-09-04	Flow soldering apparatus
JP2008053655A	2006-08-28	Soldering device and method
JP2008041854A	2006-08-04	Method of forming hybrid wave, and hybrid wave formation apparatus
JP2008030072A	2006-07-27	Alip type flow soldering apparatus
JP2008030073A	2006-07-27	Electromagnetic pump type flow soldering apparatus
JP2008030074A	2006-07-27	Alip type flow soldering apparatus
JP2006212711A	2006-05-22	Soldering bath
JP2007095919A	2005-09-28	Jet wave generating device for mounting alip type electronic component
JP2007095918A	2005-09-28	Jet wave generating device for mounting electronic component
JP2007090379A	2005-09-28	Soldering apparatus, and method for starting soldering apparatus
JP2007095920A	2005-09-28	Multi-type jet wave generating device
JP2007067140A	2005-08-31	Atmosphere processor
JP2006339171A	2005-05-31	Reflow soldering apparatus and reflow soldering method
JP2006028638A	2005-01-13	Method for surface-treating ferroalloy material for lead-free solder, and device for packaging electronic parts having equipment treated with the method
JP2006093281A	2004-09-22	Flow soldering apparatus