Air diffuser for ventilation equipment having heat exchanging member
KR20100051754A
Through-silicon-vias processed by pressure infiltration method of molten metals and the chip stack packages consisted of the same
KR20090125230A
Fabrication methods of antimony-telluride thermoelectric thin film devices
KR20090108744A
Flip Chip Packages with Bump/Pad Joints Locally Surrounded by Adhesive and the Process Methods Using the Same
KR100842152B1
Thin film thermoelectric module processed using electroplating and the fabrication methods of the same
KR20080068334A
Chip stack packages using sn vias or solder vias and their bumping structures and the fabrication methods of the same
KR20070122115A
Flip chip method and detaching method of ic chip using thin film heater fabricated on ic chip
KR20060061327A
Formation method of solder bumps using thin film heater fabricated on ic chip or ic chip wafer and the facility to make the same
KR20060037309A
Interlocking bumping structures and chip bonding processes using the same
KR20060041196A
Carbon nanotube reinforced composite bumps and chip-on-glass bonding and flip chip bonding processes using the same
KR20060032185A
Carbon nanotube reinforced composite solders and mounting methods using the same
KR20040101684A
Surface mounting methods of electronic components on flat panel display using induction heating body in the AC magnetic field and the apparatus which uses the same methods
KR20040067765A
Mounting methods of IC chips on flat panel display using induction heating body in the AC magnetic field and the apparatus which uses the same methods
KR20040067048A
The flip chip bonding method using induction heating body in the AC magnetic field and the apparatus which uses the same method
