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OCTAVO SYSTEMS LLC

Overview
  • Total Patents
    41
  • GoodIP Patent Rank
    37,042
  • Filing trend
    ⇧ 18.0%
About

OCTAVO SYSTEMS LLC has a total of 41 patent applications. It increased the IP activity by 18.0%. Its first patent ever was published in 2015. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and Taiwan. Its main competitors in its focus markets semiconductors, computer technology and audio-visual technology are REFAI-AHMED GAMAL, CHEAH BOK ENG and ROBOTRON ELEKTRONIK.

Patent filings in countries

World map showing OCTAVO SYSTEMS LLCs patent filings in countries

Patent filings per year

Chart showing OCTAVO SYSTEMS LLCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Frantz Gene Alan 35
#2 Murtuza Masood 27
#3 Welsh Erik James 14
#4 Linder Peter 10
#5 Dantu Neeraj Kumar Reddy 7
#6 Linder Peter Robert 6
#7 Troy Kevin Michael 5
#8 Sheridan Gregory Michael 4
#9 Panchavati Shankar Jayaraman 4
#10 Simar Jr Laurence Ray 3

Latest patents

Publication Filing date Title
WO2020132019A1 Molded packages in a molded device
US2020066702A1 System in a package connectors
US2019273073A1 Service module for sip devices
WO2019165257A1 Analog arithmetic unit
US2020403618A1 Mixed signal computer
WO2019165272A1 Analog memory cells with valid flag
WO2019075205A1 High performance module for sip
US2019027443A1 EMI shield for molded packages
US2018317323A1 System-in-package device ball map and layout optimization
US2018317316A1 Reduction of passive components in system-in-package devices
US2020134268A1 Mixed signal computer architecture
WO2018144561A1 Automatic test equipment method for testing system in a package devices
US2019347378A1 Method for routing bond wires in system in a package (sip) devices
US2019206779A1 Substrate for use in system in a package (sip) devices
US2018321313A1 Component communications in system-in-package systems
WO2017136305A1 Systems and methods for manufacturing electronic devices
EP3345213A1 Improved system using system in package components
US2017287885A1 Substrate for system in package (SIP) devices