| # | Country | Total Patents | |
|---|---|---|---|
| #1 | WIPO (World Intellectual Property Organization) | 11 | |
| #2 | Taiwan | 10 | |
| #3 | China | 2 | |
| #4 | EPO (European Patent Office) | 2 | |
| #5 | United States | 2 |
| # | Industry | |
|---|---|---|
| #1 | Surface technology and coating | |
| #2 | Machine tools | |
| #3 | Semiconductors | |
| #4 | Audio-visual technology | |
| #5 | Machines |
| # | Name | Total Patents |
|---|---|---|
| #1 | Talieh Homayoun | 22 |
| #2 | Uzoh Cyprian | 21 |
| #3 | Basol Bulent | 13 |
| #4 | Basol Bulent M | 7 |
| #5 | Volodarsky Konstantin | 6 |
| #6 | Young Douglas W | 5 |
| #7 | Volodarsky Rimma | 4 |
| #8 | Lindquist Paul | 4 |
| #9 | Uzoh Cyprian E | 3 |
| #10 | Nagorski Boguslaw A | 2 |
| Publication | Filing date | Title |
|---|---|---|
| WO0163019A1 | Pad designs and structures with improved fluid distribution | |
| WO0184617A1 | Conductive structure for use in multi-level metallization and process | |
| WO0158643A1 | Modified plating solution for plating and planarization and process utilizing same | |
| US6354916B1 | Modified plating solution for plating and planarization and process utilizing same |